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Description

Semiconductor & Electronic Assembly Adhesives

Epoxyset manufactures a wide range of products designed specifically for use electronic assembly. We supply materials for use in dam & fill, glob top, die attach, underfills etc. Our products are tested and proven to work for numerous applications and range in properties such as viscosity, conductivity, and cure times to fulfill a wide range of specifications. Below are some of our featured products but not our entire product line. Contact Epoxyset for more options and details.

Item # Color Specific Gravity Service Temperature Thermal Conductivity Volume Resistivity Data Sheet
Silver 3.6 -55°C to 200°C 2.0 0.0004 download
Silver 3.50 -55°C to 250°C 1.8 <0.0003 download
Silver 3.90 -55°C to 200°C 4.2 <0.0003 download
Silver 3.90 -55°C to 200°C 2.0 <0.0004 download
Grey 2.1 -55°C to 230°C 2.4 >1x1015 download
Amber 1.18 -55°C to 230°C NA >1014 download
Black 1.56 -55°C to 220°C 0.4 6x1015 download
Black 1.6 -55°C to 150°C 0.5 >1015 download
Black 2.10 -55°C to 230°C 1.4 6x1015 download
Black 1.82 -55°C to 200°C 0.8 >1015 download
Black 1.82 -55°C to 200°C 0.8 >1015 download
Black 1.82 -55°C to 200°C 0.4 2 x 10^15 download
Black 1.82 -55°C to 200°C 0.4 2 x 10^15 download
Black 1.5 -55°C to 175°C 0.45 >1015 download
Black 1.76 -55°C to 200°C 0.3 2 x 10^15 download
Beige/Amber 1.8 -55°C to 200°C 0.3 2 x 10^15 download
Black 1.5 -55°C to 220°C 0.45 >1015 download
Black 2.10 -55°C to 250°C 1.8 6x1015 download
Grey 1.9 -55°C to 250°C 1.0 6x1015 download
White/Amber 1.45 -55°C to 200°C 1.0 6x1015 download
Grey 2.1 -55°C to 230°C 2.4 >1x1015 download
Clear Amber 1.2 -55°C to 250°C NA >1015 download