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Description

Urethane potting and encapsulating compounds offer advantages when needing to cure at lower temperatures and/or quickly compared to epoxy systems. Urethanes offer better flexibility and crack resistance as well as better adhesion to certain substrates such as many plastics and composites. Many urethane products Epoxyset offers use renewable raw materials making it less harmful to the end user. It is ideal for electronic applications, surface mount technology, and when thermal cycling resistance is a requirement. Epoxyset urethane potting materials have low CTE rates ensuring flexibility at even extremely low temperatures.

Item # Mix Ratio by Weight Mixed Viscosity @RT(cps) Pot Life @25°C
(100 gram)
Recommended Cure Hardness(Shore) Service Temperature Data Sheet
16/100 1500-3000 60-90 min 5-7 days @ 25°C A-86 -55°C to 130°C download
25/100 2000-4000 20-30 min 5-7 days @ 25°C D-50 -55°C to 110°C download
8/100 5000-8000 30-60 min 24 hrs @ 25°C + 2 hrs @ 80°C A-70 -55°C to 110°C download
45/100 400-800 30-60 min 2 hrs @ 80°C A-70 -55°C to 120°C download
44/100 4000-6000 20-30 min 4-6 hrs @ 80°C A-70 -55°C to 110°C download
15/100 4000-8000 8-12 min 24 hrs @ 25°C A-88 -55°C to 110°C download