Heat Dissipation of Adhesives
Small, tightly packaged circuits and components generate excess heat that can affect the performance and reliability of electronic components. With a constant push to further compact electronic packaging, the need for thermally conductive adhesives used to dissipate unwanted heat is more essential than ever. Areas for miniaturization include mobile phones, computers and vehicle engine downsizing.
EB-316TC-2 is a highly filled, thermally conductive epoxy adhesive in a convenient 1:1 mix ratio. It is a toughened epoxy with extremely high bond strength and high heat dissipation. With a thermal conductivity of 3.2 W/mK, EB-316TC-2 is excellent for drawing heat away from electronic components. In LED applications, EB-316TC-2 is used as an environmental seal and thermal management on the LED. In aerospace applications, EB-316TC-2 is used as a sealant for gyroscopes in guidance systems.
|Mix Ratio by Weight||100/100|
|Mixed Viscosity @RT(cps)||>250,000|
|Pot Life @25°C(100 gram)||45min|
|Recommended Cure||2hr @ 80°C|
|Alternate Cure||24hr @ 25°C + 1hr @ 100°C|
|Lap Shear Strength @25°C(psi)||3000|
|Service Temp.Range||-55°C to 150°C|
|Volume Resistivity(500 V)||3.0 x 10^14|