Search Catalog:

EB-316TC-2

Heat Dissipation of Adhesives

Description

product image EB-316TC-2 epoxy by EpoxySet

Small, tightly packaged circuits and components generate excess heat that can affect the performance and reliability of electronic components. With a constant push to further compact electronic packaging, the need for thermally conductive adhesives used to dissipate unwanted heat is more essential than ever. Areas for miniaturization include mobile phones, computers and vehicle engine downsizing.

EB-316TC-2 is a highly filled, thermally conductive epoxy adhesive in a convenient 1:1 mix ratio. It is a toughened epoxy with extremely high bond strength and high heat dissipation. With a thermal conductivity of 3.2 W/mK, EB-316TC-2 is excellent for drawing heat away from electronic components. In LED applications, EB-316TC-2 is used as an environmental seal and thermal management on the LED. In aerospace applications, EB-316TC-2 is used as a sealant for gyroscopes in guidance systems.

Specifications

No.of Components 2
Mix Ratio by Weight 100/100
Mixed Viscosity @RT(cps) >250,000
Pot Life @25°C(100 gram) 45min
Recommended Cure 2hr @ 80°C
Alternate Cure 24hr @ 25°C + 1hr @ 100°C
Color Black
Specific Gravity 2.1
Hardness(Shore) D-81
Refractive Index NA
Lap Shear Strength @25°C(psi) 3000
Tg(°C) 90
CTE(Below Tg)10-6/°C 77
Service Temp.Range -55°C to 150°C
Thermal Conductivity(W/m°K) 3.2
Volume Resistivity(500 V) 3.0 x 10^14