EB-403-1 is a one component, highly filled, thermally conductive adhesive. EB-403-1 employs conductive fillers using different particle sizes which increases conductivity and decreases settlement. Studies show that significant decreases in the viscosities can be obtained using a two-component filler system which permits the use of higher filler loadings. The increase in the ratio of coarse filler to fine filler reduced the flexural strength of the castings and increased the rate of settling in the formulations.
EB-403-1 is used as an adhesive in several electronics products including hybrid multi-chip modules, high temperature oscillators, and crystal and IC filters. It is used inhigh temperature crystal oscillator product platforms for extreme environment applications. Typical operating temperature range is from –55°C to +200°C but can go as high as 230°C.
|Mix Ratio by Weight||NA|
|Mixed Viscosity @RT(cps)||>800,000|
|Pot Life @25°C(100 gram)||4 months|
|Alternate Cure||30min @ 150°C|
|Lap Shear Strength @25°C(psi)||2620|
|Service Temp.Range||-55°C to 220°C|
|Volume Resistivity(500 V)||6.0 x 10^15|