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EB-403-1ALAN

Cost of thermal adhesives

Description

product image EB-403-1-ALAN epoxy by EpoxySet

The cost of thermal materials is very dependent on the type of filler, the amount of filler, and the other unique qualities of the adhesive. While there several low cost, thermally conductive adhesives available from Epoxyset, certain unique, high performance adhesives may cost more but also deliver much more. EB-403-1-ALAN is a unique, high performance adhesive incorporating a blend of highly conductive fillers.

EB-403-1-ALAN is been specially formulated to have extremely high conductivity while still being cost efficient. Adding multiple fillers and using multiple sized particles, EB-403-1-ALAN of 2.4 W/mK. EB-403-1-ALAN is used anywhere requiring high heat transfer including PCB flex bonding, LED heat sinks, and drum core bonding.

Specifications

No.of Components 1
Mix Ratio by Weight NA
Mixed Viscosity @RT(cps) >800,000
Pot Life @25°C(100 gram) 3 months
Recommended Cure 1 hr @ 100°C + 1 hr @ 150°C
Alternate Cure 30min @ 150°C
Color Grey
Specific Gravity 2.1
Hardness(Shore) D-90
Refractive Index NA
Lap Shear Strength @25°C(psi) 2620
Tg(°C) 132
CTE(Below Tg)10-6/°C 38
Service Temp.Range -55°C to 230°C
Thermal Conductivity(W/m°K) 2.4
Volume Resistivity(500 V) 1.0 x 10^15