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EB-403-1ALAN

High thermal conductivity epoxy

Description

product image EB-403-1-ALAN epoxy by EpoxySet

Thermal conductivity of adhesive systems depends on a number of factors including type and amount of filler, size of fillers, air etc. Many thermally conductive adhesive use one type of filler and one size of filler which adds conductivity but only a little. EB-403-1-ALAN is been specially formulated to have extremely high conductivity while still being cost efficient. Adding multiple fillers and using multiple sized particles, EB-403-1-ALAN of 2.4 W/mK. EB-403-1-ALAN is used anywhere requiring high heat transfer including PCB flex bonding, LED heat sinks, and drum core bonding.

Specifications

No.of Components 1
Mix Ratio by Weight NA
Mixed Viscosity @RT(cps) >800,000
Pot Life @25°C(100 gram) 3 months
Recommended Cure 1 hr @ 100°C + 1 hr @ 150°C
Alternate Cure 30min @ 150°C
Color Grey
Specific Gravity 2.1
Hardness(Shore) D-90
Refractive Index NA
Lap Shear Strength @25°C(psi) 2620
Tg(°C) 132
CTE(Below Tg)10-6/°C 38
Service Temp.Range -55°C to 230°C
Thermal Conductivity(W/m°K) 2.4
Volume Resistivity(500 V) >10^15