Boron Nitride filler for thermal conductivity
While there are several different available conductive fillers, boron nitride is used commonly used as high performance conductive filler. Boron nitride filled epoxy adhesive can ideal for applications needing high thermal resistance and insulation to prevent electrical shorts.
EB-430-1 is a boron nitride filled, high temperature epoxy adhesive. With a relatively filler content and flowable rheology, EB-430-1 has a thermal conductivity of over 1.0 W/mK and very low thermal impedance of 0.05°C in2/W (2 mil). EB-430-1 delivers higher conductivity than standard metal filled systems with the same loaded amount and is also more insulating. EB-430-1 is used as a die attach for heat sinks, LED, and thermal sensors.
|Mix Ratio by Weight||100/4|
|Mixed Viscosity @RT(cps)||60,000-80,000|
|Pot Life @25°C(100 gram)||24 hrs|
|Recommended Cure||4 hrs @100°C|
|Alternate Cure||10 min @ 150°C|
|Lap Shear Strength @25°C(psi)||2000|
|Service Temp.Range||-55°C to 200°C|
|Volume Resistivity(500 V)||6x1015|