EC-M22T-1 is a thixotropic, premixed and frozen, high temperature adhesive specially designed as an epoxy dam material for electronic assembly in dam-and-fill encapsulation. An epoxy dam makes an open barrier, or dam. Either cured or uncured, it can be filled using another epoxy or liquid adhesive. Dam-and-fill encapsulation is generally used to protect small dies or wires.
EC-M22T-1 is an engineered damming epoxy as a flow control barrier around areas of bare chip encapsulation. EC-M22T-1 is ideal for applications requiring a taller, narrower dam. It also has very low ion content, a key feature in microelectronics. EC-M22T-1 cures quickly with heat and is available in premixed and frozen syringes.
|Mix Ratio by Weight|
|Mixed Viscosity @RT(cps)||>100,000|
|Pot Life @25°C(100 gram)||2 days|
|Recommended Cure||1hr@100°C + 1hr@150°C|
|Alternate Cure||2hrs @ 150°C|
|Lap Shear Strength @25°C(psi)||2000|
|Service Temp.Range||-55°C to 200°C|
|Volume Resistivity(500 V)||2 x 10^15|