EO-82M-2 is a one component system designed as a conductive thermosetting silver preparation for screen printing applications. Its composition is unique, providing high electrical and thermal conductivity with excellent bond strength after appropriate cure. EO-82M-2 epoxy is used as an advantage in place of lead-tin solders to avoid flux contamination or exposure to excessive temperature and for process simplification by screening on contacts.
By creating ohmic contacts, EO-83M-2 bonds withdoped semiconductors or if the surface of the semiconductor is metallized. The product finds extensive use in bonding semiconductor chips, integrated monolithic circuits, diodes, transistors and other components in thin film and thick film hybrid microelectronic circuits. It bonds to glass, mica, plastic, graphite, quartz and other materials as well. EO-83M-2 is stable for over 1 month without significant rise in viscosity. This can be extended if stored at temperatures below 0°C.
|Mix Ratio by Weight||NA|
|Mixed Viscosity @RT(cps)||11,000 - 14,000|
|Pot Life @25°C(100 gram)||1 month|
|Recommended Cure||10-15 min @ 175°C|
|Alternate Cure||30-45 min @ 150°C|
|Lap Shear Strength @25°C(psi)||>1600|
|Service Temp.Range||-65°C to 200°C|
|Volume Resistivity(500 V)||<0.0004|