EB-350-3FL-LV

ONE COMPONENT EPOXY ADHESIVE & ENCAPSULANT

EB-350-3FL-LV

EB-350-3FL-LV is one part, heat cured epoxy resin system. Applications include potting and encapsulating small densely packaged power supplies, integrated circuits, thick film hybrid devices, D/A converters, oscillators, amplifiers, relays, transformers and semiconductors etc.

Fully cured EB-350-3FL-LV provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals including petroleum solvents, lubricating oils, and alcohol.

Product Specifications

No.of Components 1
Mix Ratio by Weight
Mixed Viscosity @RT(cps) 30,000-40,000
Pot Life @25°C(100 gram) 20
Recommended Cure 1 hr @ 80°C+ ½ hr/150°C
Alternate Cure 2 hrs @ 125°C
Color Black
Specific Gravity 1.52
Hardness(Shore) D-62
Refractive Index NA
Lap Shear Strength @25°C(psi) 2000
Tg(°C) 110
CTE(Below Tg)10-6/°C 58
Service Temp.Range -55°C to 230°C
Thermal Conductivity(W/m°K) 0.8
Volume Resistivity(500 V) 1 x 10^15

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