For years, lead/tin soldering has been widely used to make electrical connections in electronic components. During the soldering process, the components are subjected to very high temperatures and many sensitive components can be damaged at extreme temperatures. Also, in recent years there has been a push to replace lead materials due to its harmful environmental impact and toxic nature. In certain solder applications, electrically conductive epoxy has become a highly regarded alternative.
EO-24M-1 is a high temperature, electrically conductive epoxy used as a solder replacement in many applications. Its low viscosity but thixotropic nature makes it ideal for screen printing and die attach applications. Very versatile on the production floor, EO-24 can be cured in less than 1 minute at 175°C. Many different curing methods can be employed including tunnel ovens, heat guns, infrared tunnels, or inductor coils. In opto-electronic packaging applications, EO-24 is used to die attached LED chips to substrates in single chip packages or arrays. EO-24 meets NASA outgassing standards when cured properly and can be used in Rf and EMI shielding applications.
|Mix Ratio by Weight||100/100|
|Mixed Viscosity @RT(cps)||2000-4000|
|Pot Life @25°C(100 gram)||>2 days|
|Recommended Cure||2 hrs @ 100°C|
|Alternate Cure||15 min @ 125°C|
|Lap Shear Strength @25°C(psi)||1400|
|Service Temp.Range||-55°C to 200°C|
|Volume Resistivity(500 V)||0.0004|
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