Potting & Encapsulating Compounds

Urethane Potting Compounds

Urethane potting and encapsulating compounds are selected when flexibility, fast cure, or lower cure temperatures are required. Compared to many epoxy systems, urethanes typically provide:

• Better flexibility and crack resistance

• Improved adhesion to plastics and composite substrates

• Good performance under thermal shock and vibration

• Low temperature cure profiles that protect heat sensitive components

Many Epoxyset urethane systems incorporate renewable raw materials. This can reduce impact on the end user while still delivering robust performance. Urethane potting compounds are widely used for electronic assemblies, surface mount technology, and applications that require reliable performance over a wide temperature range with low coefficient of thermal expansion

Thermally Conductive Potting Compounds

Epoxyset specializes in thermally conductive potting compounds that manage heat while maintaining electrical insulation. These systems are formulated with engineered fillers to deliver consistent thermal performance while remaining process friendly.

Thermally conductive potting materials are available with:

• Room temperature or elevated temperature cure schedules

• A range of viscosities for casting, potting, or filling complex geometries

• Options for high temperature resistance and low outgassing

• Options that combine thermal conductivity with flame retardant properties

These materials are used extensively in power electronics, LEDs, sensors, motor drives, medical devices, and aerospace and automotive assemblies where reliable heat dissipation is critical.

Silicone Potting and Encapsulating Compounds

Silicone potting and encapsulating compounds provide excellent performance where high temperature stability and flexibility are required. Epoxyset silicone systems are used for:

• Electronic ballasts and power supplies

• Capacitors and high voltage components

• Relays, control modules, and devices with high heat dissipation

Silicone materials can maintain properties at temperatures above 200 °C while resisting cracking under rapid thermal cycling. Many Epoxyset silicone potting compounds carry UL listings for flame retardant performance and support long term reliability in harsh environments.

One Component Epoxy Potting and Encapsulating Compounds

One component epoxy potting compounds from Epoxyset provide convenient processing and consistent performance. These materials are designed for:

• Encapsulation of small electronic components

• Microelectronic and hybrid assemblies

• Applications that benefit from pre-mixed, frozen or single package systems

Many one component epoxies are tested for RoHS, REACH, and halogen free compliance. They deliver reliable adhesion, electrical insulation, and mechanical strength for electronic assembly, medical, aerospace, and automotive applications.

High Temperature Potting Compounds

Epoxyset offers potting and encapsulating compounds that are engineered for extended service at elevated temperatures. Selected products can withstand continuous temperatures above 250 °C while maintaining:

• Electrical insulation and low leakage

• Resistance to cracking and mechanical breakdown

• Dimensional stability and low thermal expansion

High temperature potting compounds are used in power electronics, under hood automotive components, sensors, heaters, and other assemblies where long term exposure to high temperature environments is expected. Many of these systems are available with thermal conductivity, flame retardancy, or other performance features.

General Purpose Potting Compounds

For applications that do not require a specialized chemistry, Epoxyset supplies a wide range of general purpose epoxy, urethane, and silicone potting compounds. These materials cover:

• Standard electronic assemblies and modules

• Control boxes, junction boxes, and small transformers

• Sensors and low to moderate temperature applications

Formulations can include options for thermally conductive fillers, low expansion, and flame retardant performance. When a standard product does not meet your requirements, Epoxyset can also develop custom formulations to align with your process and performance needs.

Flame-Retardant Potting and Encapsulating Compounds

Flame retardant potting and encapsulating compounds from Epoxyset are designed to help manufacturers meet safety and regulatory requirements. Available in epoxy, urethane, and silicone chemistries, these materials:

• Are bromine free and halogen free

• Are RoHS and REACH compliant

• Include products tested to UL 94 V-0

Flame retardant systems are used where electronic assemblies must meet industry standards for fire safety, including power supplies, control modules, lighting, transportation electronics, and industrial equipment.