Advantages of UV Cure Epoxy

Cationic epoxy, more commonly UV cure epoxy, refers to a type of epoxy resin system that cures through a cationic (positively charged) polymerization mechanism. Epoxy resins are polymers widely used in various industrial applications, including adhesives, coatings, and composites, due to their excellent adhesive properties, chemical resistance, and mechanical strength. In a cationic epoxy system, the curing process involves the reaction of epoxy groups (usually present in the resin) with…
Paven Patel
March 27, 2024
Electronicspotting and encapsulating

The Importance of Choosing the Right Electronic Potting Compound

In today’s market, electronic components are subjected to some pretty brutal environments that can drastically diminish the working life of electronic devices. However, manufacturers can take steps to reduce environmental and mechanical exposures by utilizing potting compound and encapsulation methods. Advancements in materials science have led to innovative solutions to protect sensitive electronic components from damage and prolong their life. Electronic potting uses these state-of-the-art materials to create a protective…
Paven Patel
March 8, 2024
ElectronicsEpoxy Adhesive

Electrically Conductive Adhesive: Enabling Technologies in Electronics

If you’ve ever seen the inside of any modern electronic device, you’ll see the inner workings of advanced technologies held together with state-of-the-art adhesives. These adhesives are designed to help maintain the electrical current throughout the device, replacing bulky bonding methods such as solder. As such, electronic manufacturers are able to produce smaller, lighter, and more reliable devices using specially formulated electrically conductive adhesives. How Does an Electrically Conductive Adhesive…
Paven Patel
February 23, 2024

Active Alignment Adhesive: FLASHBOND UV-3720

Epoxyset, a leading manufacturer of epoxy adhesives, introduces its FLASHBOND UV-3720, a light and/or heat-curable cationic epoxy specifically designed for active alignment applications. These include camera modules, optical components, LiDAR (Light Detection and Ranging), and other ADAS (Advanced Driver Assistance Systems) assemblies used in automotive applications. During the optical assembly process of many components need to be positioned exactly and efficiently. Types of assemblies include lenses in cameras, CCD chips,…
Paven Patel
February 21, 2024
Thermal Management

Thermal Adhesive Epoxy: A Guide to Effective Application and Use

There are a number of ways to bond different materials or substrates, with epoxy being a popular option due to its durability under harsh conditions. Thermal adhesive epoxy is an umbrella term for any industrial resin-based adhesive consisting of thermosetting polymers that cure or harden via a chemical reaction at room temperature or with heat.  When properly applied, thermal epoxy adhesives create ultra-high strength bonds capable of withstanding fluctuating temperatures,…
Paven Patel
February 7, 2024
potting and encapsulating

Battery Potting and Encapsulation

Utilizing potting and encapsulation compounds in your battery pack design can optimize the performance of your end product. There are three basic types of resins used in this process; these materials are epoxy, urethane, and silicone. These polymeric formulations have excellent adhesion, thermal stability and outstanding chemical resistance. Battery potting and encapsulation compounds are used to provide mechanical reinforcement to housed assemblies, to fill large voids, and to protect components…
Paven Patel
October 31, 2023

Flip Chip Die Attach

Flip chip die attach is a technique used in the semiconductor and microelectronics industry for connecting semiconductor chips (known as dies) directly to substrates or carrier packages. In this method, the chip is flipped over and attached facedown onto the substrate or carrier using a conductive adhesive material. This is in contrast to the traditional wire bonding method, where the connections are made by bonding wires from the chip to…
Paven Patel
October 30, 2023
Epoxy Adhesive

Electrically Conductive Adhesives

Silver-filled epoxies are a type of electrically conductive adhesive that contains silver particles or flakes as a filler material within an epoxy resin matrix. These adhesives are designed to provide both electrical conductivity and strong mechanical bonding properties. They are commonly used in various applications, particularly in electronics and microelectronics, where a reliable and electrically conductive bond is required. Electrical conductivity of an adhesive is typically measured by its volume…
Paven Patel
October 6, 2023

Dam and Fill Encapsulation

"Dam and fill" is a technique used in electronics manufacturing and semiconductor packaging to address the challenges of encapsulating delicate components with epoxy resin or other encapsulant materials. In certain electronic devices, there might be components that are placed relatively close to each other on a circuit board or within a semiconductor package. These components can generate heat during operation, and the thermal expansion and contraction rates of different materials…
Paven Patel
August 23, 2023
potting and encapsulatingRecent-news

Polyurethane Potting Compounds

Polyurethane potting compounds are a type of thermosetting polymer material commonly used in electronics and electrical applications for encapsulating or potting electronic components. Potting refers to the process of enclosing or embedding components in a protective compound to enhance their durability, protect against environmental factors, and provide electrical insulation. Polyurethane potting compounds are formulated by combining two main components: a polyol resin and an isocyanate hardener. These components react chemically…
Paven Patel
July 7, 2023