Light Cure Encapsulating Materials

Encapsulation of chips and modules on PCBs, smart cards, and flex circuits are increasingly prevalent in the ever growing digital and hands-free world. The global smart card market had a value of $10.19 in 2019 and is expected to grow to over $15 billion by 2027. Smart cards are becoming increasingly popular due to its enhanced speed and security. Smart card usage ranges from credit cards, gift cards, government and…
Paven Patel
January 13, 2022
Epoxy AdhesiveRecent-newsUV/LED


Epoxyset is proud to announce the nomination of its new UV/Heat cure epoxy, FLASHBOND UV-3607HT for Product of the Year at the Assembly Show 2021 in Rosemont, IL. This is second year (2019) Epoxyset has been nominated for this award. You can read the details from Assembly Show website here. Visit us at Booth 1811 at the Donald E. Stephens Convention Center in Rosemont, IL on Oct. 25-28 to learn…
Paven Patel
October 14, 2021
potting and encapsulating

Coil Impregnation Epoxy

A common application for epoxy potting and encapsulating materials is coil impregnation in electrical transformer manufacturing. Transformer coils are encapsulated for a variety of reasons including: Increase dielectric strength Improve the structural integrity of the coils Reduce or eliminate winding noise Improve heat transfer Reduce partial discharge Provide increased environmental protection Why use epoxy when needing to encapsulate coil windings in transformers? Epoxy potting and encapsulating compounds offer the best…
Paven Patel
October 5, 2020
Epoxy AdhesiveFeatured Products

FLASHBOND UV-6502CL – Clear Light Curable Adhesive

CLEAR LIGHT CURABLE ADHESIVE Epoxyset presents FLASHBOND UV-6502CL, a water white clear light curable adhesive for bonding, coating and sealing. Typical applications in for high strength bonding in electronics and opto-electronics industries. UV-6502CL is a very versatile adhesive with many application uses. This low viscosity, light curable adhesive is an epoxy with low cure shrinkage and high clarity. UV-6502CL cures best at 310-380nm wavelengths and will cure in under 6-8…
Paven Patel
June 3, 2020
Epoxy AdhesiveFeatured Products

EPOXIBOND EB-116 – High Strength Epoxy Adhesive

Epoxyset presents EPOXIBOND™ EB-116, a high strength epoxy adhesive for bonding, encapsulating and sealing. Typical applications in for high strength bonding in electronics and opto-electronics industries. EB-116 is one of the most versatile products Epoxyset offers. It is used worldwide as an adhesive, potting and encapsulating system, sealant, and coating. Applications This high strength epoxy adhesive cures to a semi-rigid polymer. Consequently it is excellent for temperature cycling from -55°C…
Paven Patel
May 4, 2020
ElectronicsEpoxy AdhesiveUV/LED

FLASHBOND™ UV-5608DC Light Activated, Delay Cure Epoxy Adhesive

Delay Cure Epoxy Adhesive Epoxyset introduces a ground-breaking, light cure chemistry that allows fast processing and fixturing of parts even if both parts are opaque. This is known as a delay cure epoxy adhesive.  UV-5608DC is one of a series of epoxy adhesives that can be activated by 405nm light with an intensity of about 150mW/cm2 for 5-10 seconds.  Parts are mated together and aligned within 45-60 seconds of activation.…
August 19, 2019
Thermal Management

TGF-331 -Thermally Conductive Liquid Gap Filler

Epoxyset's dispensable liquid gap fillers round out its line of thermal management compounds designed for ease of use and high performance. Highlight by easy 1:1 mix ratios and excellent rheological properties, our thermally conductive liquid gap filler products are ideal for use in high volume applications such as filling air gaps in automatic electronic control units (ECU). Other applications include LED bonding, PCBA to housing, discrete component to heat spreader, computer…
June 14, 2019
Epoxy AdhesiveFeatured Products

Delay UV Cure Epoxy

Unlike typical free radical curing adhesives & sealants, cationic UV epoxy adhesives can be formulated to cure between opaque substrates. The delay UV cure epoxy (sometimes referred to as dark cure) still requires light to activate the adhesive but due to the unique polymerization mechanism of highly innovative and engineered epoxy cationic systems, the cure will complete in absence of additional light. What is a Free Radical Adhesive? Typical UV…
June 7, 2019
potting and encapsulatingUncategorized

Epoxy Potting Compounds for Motors and Stators

Epoxyset has a wide line of epoxy potting and encapsulating compounds for motors and stators. Currently, our epoxy potting compounds are being used by motor manufacturers worldwide to encapsulate thousands of stators every day. Our suite of products vary in physical and handling properties that allow manufacturers to choose the right system for the application but all our systems are formulated for robust performance and have the following properties. Our epoxy…
May 15, 2019

New NASA Outgassing Epoxy Potting System

Epoxyset is pleased to announce that its EPOXICAST EC-1850FT with EH-9 curing agent has recently passed NASA Outgassing tests. Outgassing is the measure of the level of residual low molecular weight species (including water if the material is not conditioned in a low moisture environment prior to testing) that can be evolved at high temperatures. NASA outgassing has a specific set of standards to meet demanding applications. Many unique applications usually…
March 13, 2019