Epoxy AdhesiveMedical Devices

Epoxy Adhesives Engineered to Withstand Medical Device Sterilization

Reusable Medical Devices such as endoscopes, ultrasound probes, surgical instruments, catheters, imaging equipment, and diagnostic sensors must perform reliably in environments that are demanding both mechanically and chemically. One of the most challenging requirements is repeated cleaning, disinfection, and sterilization. The adhesive holding a lens, sensor, cable, housing, transducer, or electronic assembly together may be exposed hundreds—or potentially thousands—of times to elevated temperatures, moisture, aggressive disinfectants, or sterilizing agents. Selecting…
Paven Patel
August 13, 2026
Epoxy AdhesiveMedical Devicespotting and encapsulating

New Products for Endoscope Camera Bonding

Adhesives Used in Endoscope Manufacturing: Bonding for Reliability and Performance Endoscopes are sophisticated medical devices that combine optics, electronics, illumination, and mechanical components within an extremely compact assembly. Whether used in flexible or rigid endoscopes, specialized medical-grade adhesives play an important role in maintaining structural integrity, protecting sensitive components, and supporting reliable performance. Epoxyset has developed 2 new adhesives specially formulated for use in endoscopy; specifically for lens bonding and…
Paven Patel
August 11, 2026
ElectronicsEpoxy AdhesiveMedical DevicesUV/LED

The Benefits of Cationic Cure Epoxy Adhesives: High Performance for Demanding Applications

As industries continue to demand adhesives that deliver exceptional performance, reliability, and long-term durability, cationic cure epoxy adhesives have become an increasingly attractive solution. Unlike conventional epoxy systems that rely on amine hardeners, cationic cure epoxies polymerize through a photo-initiated or thermally initiated cationic reaction. This unique curing mechanism offers several advantages, including lower shrinkage, excellent adhesion, superior chemical resistance, and the ability to cure in challenging environments. From electronics…
Paven Patel
July 29, 2026
Electronicspotting and encapsulatingRecent-news

Data Center Adhesives and Encapsulants: A Guide to Materials for Reliable Electronics Protection

Data Center Adhesives and Encapsulants: Choosing the Right Materials for Reliable Electronics As artificial intelligence (AI), cloud computing, edge computing, and high-performance computing continue to expand, today's data centers are processing more information than ever before. This increased computing power places greater demands on electronic assemblies, power supplies, networking equipment, and cooling systems. While processors, GPUs, and liquid cooling technologies often receive the spotlight, data center adhesives and encapsulants are…
Paven Patel
July 16, 2026
Medical Devices

ISO 10993 Adhesives: Understanding Biocompatibility Requirements for Medical Device Bonding

Medical device manufacturers face strict regulatory requirements when selecting materials for products that come into direct or indirect contact with the human body. Among the most important considerations is biocompatibility, which helps ensure that materials perform safely without causing harmful biological responses. For adhesives used in medical devices, compliance with ISO 10993 is often a critical requirement. Whether bonding catheters, wearable sensors, diagnostic equipment, or implantable components, understanding ISO 10993…
Paven Patel
July 2, 2026
Epoxy AdhesiveFeatured Products

Understanding Adhesive Strength: Key Mechanical Properties and What They Mean

When selecting an adhesive for an industrial, medical, or electronic assembly, understanding adhesive strength properties is critical. Different applications place different types of stress on a bonded joint, and no single strength measurement can fully characterize an adhesive’s performance. Engineers rely on several mechanical test methods to evaluate how an adhesive will perform under real-world conditions. Among the most commonly referenced adhesive properties are lap shear strength, tensile strength, die…
Paven Patel
June 18, 2026
Electronicspotting and encapsulating

Inside the Package: A Guide to Chip Encapsulation Methods

Modern electronics are marvels of miniaturization, but raw silicon dies are fragile things. Exposed to moisture, mechanical stress, or contaminants, an unprotected chip fails quickly. Encapsulation — the process of sealing a die in protective material — is what makes semiconductor devices robust enough for the real world. Here's a look at the most common encapsulation methods, what makes each one useful, and where you'll find them. Glob Top The…
Paven Patel
June 4, 2026
potting and encapsulatingThermal Management

10 Powerful Applications and Benefits of Thermally Conductive Epoxies

Introduction to Thermally Conductive Epoxies In today’s high-performance world of electronics and engineering, thermally conductive epoxies are the unsung heroes keeping devices cool and reliable. These advanced adhesives are engineered to conduct heat efficiently while providing strong mechanical bonding and electrical insulation. Unlike traditional epoxies, which trap heat, thermally conductive versions transfer it away from sensitive components, reducing the risk of overheating and failure. At their core, these epoxies consist…
Paven Patel
October 14, 2025
UV/LED

Active Alignment Process in Optoelectronic Manufacturing

Active Alignment Process in Optoelectronics Active alignment is a precision assembly process used primarily in optical systems—such as camera modules, fiber-optic transceivers, LiDAR units, and photonic sensors—to ensure optimal coupling efficiency between optical components (e.g., lenses, lasers, fibers, photodiodes).Unlike passive alignment, which relies on mechanical tolerances and fiducial references, active alignment continuously monitors optical performance during assembly and adjusts the position of components in real time to achieve peak optical…
Paven Patel
October 8, 2025
UV/LED

Cationic vs Free Radical Reaction: Epoxies and Acrylate UV Cure Adhesives

Free-Radical Curing Mechanism Used for: Acrylates, methacrylates, unsaturated polyesters, styrenics, vinyl monomers. Initiation:Free-radical initiators (e.g., peroxides, azo compounds, or UV photoinitiators) generate radicals under heat or light.Example: R−O−O−R→ 2R⋅R-O-O-R  Propagation:The radical adds to a vinyl group (C=C), creating a growing chain radical. R⋅+CH2=CHX→R−CH2−CHX⋅R Termination:Two radicals combine or disproportionate, stopping growth. R⋅+R⋅→R−RR Very fast polymerization. Works with a wide variety of monomers. Common in UV-cure adhesives and 3D printing resins. Limitations:…
Paven Patel
October 3, 2025