potting and encapsulating

Top Benefits of Epoxy Potting and Encapsulation Compounds

How Epoxy Potting Compounds Work and What They Offer Epoxy potting compounds are a class of thermosetting resin systems used extensively for encapsulating electronic components, circuits, and assemblies. These materials provide protection, electrical insulation, and mechanical support to delicate or sensitive devices across a wide range of industries. Below is a breakdown of the key aspects and performance benefits of using epoxy potting materials: Epoxy Resin Base: Epoxy potting compounds…
Paven Patel
July 7, 2023
Uncategorized

Premixed and Frozen Adhesives

Premixed and frozen adhesives, sealants, and potting compounds have been in use in the manufacturing industry for over 40 years, primarily in the aerospace and medical device industries. Why has it excelled in those industries? The precision and consistency required when producing parts in the aerospace and medical industries is of the utmost importance. Reducing operator error, waste while also increasing efficiency is the best way for manufacturers in those…
Paven Patel
November 2, 2022
Uncategorized

Light Cure Encapsulating Materials

Encapsulation of chips and modules on PCBs, smart cards, and flex circuits are increasingly prevalent in the ever growing digital and hands-free world. The global smart card market had a value of $10.19 in 2019 and is expected to grow to over $15 billion by 2027. Smart cards are becoming increasingly popular due to its enhanced speed and security. Smart card usage ranges from credit cards, gift cards, government and…
Paven Patel
January 13, 2022
Recent-newsEpoxy AdhesiveUV/LED

FLASHBOND UV-3607HT NOMINATED FOR PRODUCT OF THE YEAR

Epoxyset is proud to announce the nomination of its new UV/Heat cure epoxy, FLASHBOND UV-3607HT for Product of the Year at the Assembly Show 2021 in Rosemont, IL. This is second year (2019) Epoxyset has been nominated for this award. You can read the details from Assembly Show website here. Visit us at Booth 1811 at the Donald E. Stephens Convention Center in Rosemont, IL on Oct. 25-28 to learn…
Paven Patel
October 14, 2021
potting and encapsulating

Coil Impregnation Epoxy

A common application for epoxy potting and encapsulating materials is coil impregnation in electrical transformer manufacturing. Transformer coils are encapsulated for a variety of reasons including: Increase dielectric strength Improve the structural integrity of the coils Reduce or eliminate winding noise Improve heat transfer Reduce partial discharge Provide increased environmental protection Why use epoxy when needing to encapsulate coil windings in transformers? Epoxy potting and encapsulating compounds offer the best…
Paven Patel
October 5, 2020
Epoxy AdhesiveFeatured Products

FLASHBOND UV-6502CL – Clear Light Curable Adhesive

CLEAR LIGHT CURABLE ADHESIVE Epoxyset presents FLASHBOND UV-6502CL, a water white clear light curable adhesive for bonding, coating and sealing. Typical applications in for high strength bonding in electronics and opto-electronics industries. UV-6502CL is a very versatile adhesive with many application uses. This low viscosity, light curable adhesive is an epoxy with low cure shrinkage and high clarity. UV-6502CL cures best at 310-380nm wavelengths and will cure in under 6-8…
Paven Patel
June 3, 2020
Epoxy AdhesiveFeatured Products

EPOXIBOND EB-116 – High Strength Epoxy Adhesive

Epoxyset presents EPOXIBOND™ EB-116, a high strength epoxy adhesive for bonding, encapsulating and sealing. Typical applications in for high strength bonding in electronics and opto-electronics industries. EB-116 is one of the most versatile products Epoxyset offers. It is used worldwide as an adhesive, potting and encapsulating system, sealant, and coating. Applications This high strength epoxy adhesive cures to a semi-rigid polymer. Consequently it is excellent for temperature cycling from -55°C…
Paven Patel
May 4, 2020
ElectronicsEpoxy AdhesiveUV/LED

FLASHBOND™ UV-5608DC Light Activated, Delay Cure Epoxy Adhesive

Delay Cure Epoxy Adhesive Epoxyset introduces a ground-breaking, light cure chemistry that allows fast processing and fixturing of parts even if both parts are opaque. This is known as a delay cure epoxy adhesive.  UV-5608DC is one of a series of epoxy adhesives that can be activated by 405nm light with an intensity of about 150mW/cm2 for 5-10 seconds.  Parts are mated together and aligned within 45-60 seconds of activation.…
rob_bdc
August 19, 2019
Thermal Management

TGF-331 Thermally Conductive Liquid Gap Filler for Electronics

EpoxySet’s dispensable liquid gap fillers complete our line of thermal management compounds designed for both ease of use and high performance. With simple 1:1 mix ratios and excellent rheological properties, our thermally conductive liquid gap fillers are well-suited for high-volume applications, including filling air gaps in automotive electronic control units (ECUs). Additional applications include LED bonding, PCBA-to-housing interfaces, discrete component-to-heat spreaders, computer hardware, peripherals, and other automotive electronics. Why choose…
rob_bdc
June 14, 2019
Epoxy AdhesiveFeatured Products

Delay UV Cure Epoxy

Unlike typical free radical curing adhesives & sealants, cationic UV epoxy adhesives can be formulated to cure between opaque substrates. The delay UV cure epoxy (sometimes referred to as dark cure) still requires light to activate the adhesive but due to the unique polymerization mechanism of highly innovative and engineered epoxy cationic systems, the cure will complete in absence of additional light. What is a Free Radical Adhesive? Typical UV…
rob_bdc
June 7, 2019