EpoxySet’s dispensable liquid gap fillers complete our line of thermal management compounds designed for both ease of use and high performance. With simple 1:1 mix ratios and excellent rheological properties, our thermally conductive liquid gap fillers are well-suited for high-volume applications, including filling air gaps in automotive electronic control units (ECUs). Additional applications include LED bonding, PCBA-to-housing interfaces, discrete component-to-heat spreaders, computer hardware, peripherals, and other automotive electronics.
Why choose a liquid gap filler instead of a thermal gap pad?
Liquid gap fillers may require processing time, but they are typically far more cost-effective than gap pads. The production cost of thermal pads makes them a much more expensive option. In addition, liquid gap fillers are more versatile, capable of covering a wider range of applications and larger surface areas. While thermal pads offer uniform thickness, the same benefit can be achieved with liquid gap fillers using spacer beads, which EpoxySet can incorporate on request.
What does EpoxySet offer?
Our most popular product, TGF-331 thermally conductive liquid gap filler, offers a working time of 30 minutes and cures to form a low-durometer polymer that applies virtually no stress to components. It can also cure rapidly at elevated temperatures and maintains an operating range up to 205°C. With a thermal conductivity of 3.6 W/m·K, TGF-331 provides an excellent balance of flowability and slump resistance thanks to its highly thixotropic yet low-viscosity formulation.
Click here to review the data sheet for TGF-331.
TGF-331 is available in 5-gallon pails for high-volume use as well as 50 ml dual cartridges for small-scale applications. If you are experiencing long lead times for other brands of gap fillers, such as Bergquist, contact EpoxySet for faster turnaround and reliable performance.
