Advanced Adhesive Technology

Thermally Conductive Epoxy Adhesives

Epoxyset is a leader in formulating thermally conductive epoxy adhesives used in aerospace, electronic, semiconductor, and medical applications. These one and two component systems are available in a range of viscosities and cure profiles to fit different assembly processes.

Key properties include:

• Excellent electrical insulation

• High bond strength to a variety of substrates

• Resistance to vibration, impact, and chemicals

• Halogen free options

Thermally conductive adhesives are used for bonding, potting, and encapsulation in applications such as:

• Heat sink bonding

• Potting and encapsulating sensors

• BGA die attach and chip packaging

• Power electronics and control modules

Optically Clear Adhesives

Epoxyset optical adhesives are designed for bonding and coating in fiber optic and optoelectronic applications. Typical uses include:

• Bundling and bonding optical fibers

• Bonding components in optoelectronic devices

• Assemblies for telecommunication networks, aircraft, satellites, medical devices, and scientific instruments

These formulations are engineered for non yellowing performance and resistance to UV light to help maintain long term optical clarity.

One-Component Epoxy Adhesives

Epoxyset offers a wide range of one component epoxy adhesives for electronic assembly, medical, aerospace, and automotive applications. Many formulations are:

• Tested and approved for RoHS and REACH

• Halogen free

Available from low viscosity materials to non sag pastes, the line includes options that provide:

• Flame retardant performance

• Thermally conductive properties

• Strong adhesion to metals, ceramics, and plastics

One component systems help simplify processing and support consistent bond quality.

Medical Grade Epoxy Adhesives

Medical grade epoxies from Epoxyset are used in a variety of medical device assemblies. Many systems are tested for biocompatibility to support safe human contact.

Typical applications include:

• MRI equipment and imaging devices

• Cardiac catheters and medical probes

• Ultrasound devices

• Bonding cannulae to hubs in needle assemblies

For many disposable and reusable medical devices, one part heat cure epoxies provide an economical solution with strong chemical resistance. Other adhesive chemistries used in medical assembly include light cure acrylates and cyanoacrylates. Many Epoxyset medical epoxy systems are USP Class VI certified for biocompatibility.

Dual Cartridge Adhesive Systems

Epoxyset supplies a comprehensive line of multifunctional epoxy resin systems available in easy to use dual cartridge packaging. These systems can:

• Bond, seal, and isolate a wide range of substrates

• Form structural composites

• Deliver strength, durability, and chemical resistance

Structural epoxy adhesives in this line are formulated to withstand severe impact and peel forces, while providing:

• Excellent temperature resistance

• Resistance to fuels, oils, and many chemicals

• Consistent mix ratio and dispensing in production environments

Dual cartridge systems help improve assembly efficiency, product performance, and process control.

High-Temperature Epoxy Adhesives

Epoxyset high temperature adhesives are designed for demanding environments in electronics and microelectronics, medical, aerospace, automotive, and related industries.

These systems:

• Cure quickly at moderate elevated temperatures

• Provide strong bonds to metals such as ferrite and beryllium

• Retain bond strength at elevated operating temperatures

Fully cured products exhibit:

• Excellent dielectric properties

• Very good thermal shock and impact resistance

• Good resistance to weathering, water, petroleum products, mild acids, alkalis, and many other chemicals

Semiconductor & Electronic Assembly Adhesives

Epoxyset manufactures a wide range of materials for semiconductor and electronic assembly. Products are available for:

• Dam and fill applications

• Glob top encapsulation

• Die attach

• Underfills and related processes

Formulations are tested in numerous applications and cover a broad range of:

• Viscosities for different dispensing methods

• Cure profiles to match process requirements

• Conductive and insulating properties as needed

Featured products on this page represent only a portion of the available portfolio. For additional options and details, Epoxyset can recommend materials that align with specific process and performance requirements.

Silver-Filled Epoxy Adhesives

Silver filled epoxy adhesives are used where both structural bonding and electrical conductivity are required, especially in die attach and electronic assembly where soldering may not be practical.

Epoxyset silver filled epoxies:

• Provide high electrical conductivity compared to carbon or graphite filled systems

• Maintain structural integrity and durability after cure

• Can be formulated to cure at room temperature for easier processing

These materials are designed to maximize the inherent conductivity of silver while delivering reliable mechanical performance.

Automotive Adhesives

Epoxyset formulates advanced epoxy adhesives, sealants, coatings, and potting and encapsulation compounds for automotive applications. These products are intended to meet the demanding requirements of:

• Powertrain and under hood components

• Electronic control units (ECUs) and sensors

• Structural and semi structural adhesive joints

Key attributes include:

• Resistance to vibrational shock, impact, and abrasion

• Resistance to fuels, oils, coolants, and other harsh chemicals

• Support for heat dissipation and thermal management in electronic assemblies

Automotive adhesives from Epoxyset are selected where long-term reliability and consistent performance are essential.