Thermally Conductive

Thermally Conductive Epoxy Adhesive

Epoxyset is a leader in formulating and manufacturing thermally conductive epoxy adhesives. Our line of products ranges in physical characteristics to provide options to serve a wide range of applications. Our one and two component thermally conductive epoxy adhesives are used extensively in aerospace, electronic, semiconductor and medical industries. Important properties of these adhesives include excellent electrical insulation, chemical resistance, Halogen Free, vibration and impact resistance, and high bond strength to a variety of substrates. Thermally conductive formulations are used for bonding, potting and encapsulation applications in a wide variety of industries. Some specific applications include heat sink bonding, potting/encapsulating sensors, BGA die attach, semiconductors, chip packaging.

Product Components Viscosity (cps)

Thermal Conductivity

(W/mK)

Service Temperature Strength (psi) Datasheet
EB-403-1LV-T1 1 800,000-1,200,000 1.8 -55°C-260°C 2700 Download
EB-403-1LV 1 150,000-250,000 1.4 -55°C-230°C 2200 Download
EB-403-ALAN 1 >800,000 2.4 -55°C-230°C 2600 Download
EB-485 2 >100,000 1.4 -40°C-130°C 2300 Download
EB-486 2 80,000-120,000 c 1.1 -55°C-150°C 3500 Download
EB-316TC-2 2 >250,000 1.8 -55°C-200°C 3000 Download
EB-486-ALAN 2 >100,000 2.7 -55°C-160°C 2800 Download