Semiconductor & Electronic Assembly Adhesives
Epoxyset manufactures a wide range of products designed specifically for use electronic assembly. We supply materials for use in dam & fill, glob top, die attach, underfills etc. Our products are tested and proven to work for numerous applications and range in properties such as viscosity, conductivity, and cure times to fulfill a wide range of specifications. Below are some of our featured products but not our entire product line. Contact Epoxyset for more options and details.