Electronic Assembly

Semiconductor & Electronic Assembly Adhesives

Epoxyset manufactures a wide range of products designed specifically for use electronic assembly. We supply materials for use in dam & fill, glob top, die attach, underfills etc. Our products are tested and proven to work for numerous applications and range in properties such as viscosity, conductivity, and cure times to fulfill a wide range of specifications. Below are some of our featured products but not our entire product line. Contact Epoxyset for more options and details.

Underfill

Product Viscosity (cPs) Type CTE (ppm/°C) Tg (°C) Datasheet
M22-LV-1 9,000-12,000 Flipchip 30 146 Download
M19-LV 9,000-12,000 Flipchip 26 145 Download
M19-1 20,000-25,000 Flipchip 23 133 Download
M-21 4,000-6,000 CSP/BGA 37 124 Download
M3030-LVM 45,000-55,000 CSP/BGA 16 148 Download
M3119-RW 1000-1500 Reworkable 45 106 Download
M3121-RW 900-1300 Reworkable 56 80 Download

Die Attach

Product Viscosity (cPs) Type Shear Strength (psi) Tg (°C) Datasheet;
EO-98HT 35,000-55,000 Conductive 1500 136 Download
EO-84M-1T 40,000-60,000 Conductive 1550 106 Download
EO-97M 8,000-12,000 Conductive 1600 82 Download
EB-350-1LE 30,000-40,000 Non-conductive 4400 120 Download
EB-350-3LV 50,000-70,000 Non-conductive 4200 130 Download

Encapsulants

Product Viscosity (cPs) Type Chemistry Tg (°C) Datasheet
EC-M22T 150,000-250,000 Dam Epoxy 146 Download
EC-M22T-1 250,000-350,000 Dam Epoxy 146 Download
EB-350-4T >800,000 Dam Epoxy 120 Download
EC-M22LV-1 9,000-12,000 Fill Epoxy 146 Download
EC-M22 30,000-40,000 Fill Epoxy 146 Download
EB-350-3LV 50,000-70,000 Glop Top Epoxy 130 Download
EB-403-1LV 150,000-250,000 Glob Top Epoxy 132 Download
UV-8509R 8,000 – 12,000 Glop Top UV Urethane Acrylate 25 Download
UV-8701E 5,000-9,000 Glop Top UV Epoxy 138 Download