Semiconductor & Electronic Assembly Adhesives
Epoxyset manufactures a broad range of adhesive materials specifically engineered for semiconductor packaging, printed circuit board (PCB) assembly, and advanced soldering solutions, including dam-and-fill, glob-top encapsulation, die attach, and underfills. Our proven formulations are available with a variety of physical and performance properties to meet diverse processing and performance requirements. The products featured below represent only a selection of our complete portfolio. Contact Epoxyset to discuss additional options and identify the best solution for your application.
