EC-M22LV-1
Epoxy Underfill
EC-M22LV-1
EC-M22LV-1 is a low viscosity, low CTE, epoxy underfill specially designed to fill gap sizes under 25 microns (1 mil). EC-M22LV-1 can also be used as the fill encapsulant in dam-and-fill applications due its low viscosity, and fast cure time. EC-M22LV-1 has low ionic content. This product is used in the manufacture of rigid, flex and rigid-flex printed wiring boards (PWB’s) for high reliability applications such as space, aerospace, military, medical and high-grade industrial electronics.
Product Specifications
| No.of Components | 1 |
| Mix Ratio by Weight | |
| Mixed Viscosity @RT(cps) | 9,000 - 13,000 |
| Pot Life @25°C(100 gram) | 48 hrs |
| Recommended Cure | 1hr@100°C + 2 hrs@150°C |
| Alternate Cure | 30 min @ 165°C |
| Color | Black |
| Specific Gravity | 1.82 |
| Hardness(Shore) | D-92 |
| Refractive Index | |
| Lap Shear Strength @25°C(psi) | 2000 |
| Tg(°C) | 146 |
| CTE(Below Tg)10-6/°C | 25 |
| Service Temp.Range | -55°C to 200°C |
| Thermal Conductivity(W/m°K) | 0.4 |
| Volume Resistivity(500 V) | 2 x 10^15 |
Applications & Features
- Underfill
- Fill (for Dam & Fill encapsulation)
- Fast Flow
- Snap Cure
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