Epoxy Underfill

Ec m22lv 1 scaled


EC-M22LV-1 is a low viscosity, low CTE, epoxy underfill specially designed to fill gap sizes under 25 microns (1 mil). EC-M22LV-1 can also be used as the fill encapsulant in dam-and-fill applications due its low viscosity, and fast cure time. EC-M22LV-1 has low ionic content. This product is used in the manufacture of rigid, flex and rigid-flex printed wiring boards (PWB’s) for high reliability applications such as space, aerospace, military, medical and high-grade industrial electronics.

Product Specifications

No.of Components 1
Mix Ratio by Weight
Mixed Viscosity @RT(cps) 9,000 - 13,000
Pot Life @25°C(100 gram) 48 hrs
Recommended Cure 1hr@100°C + 2 hrs@150°C
Alternate Cure 30 min @ 165°C
Color Black
Specific Gravity 1.82
Hardness(Shore) D-92
Refractive Index
Lap Shear Strength @25°C(psi) 2000
Tg(°C) 146
CTE(Below Tg)10-6/°C 25
Service Temp.Range -55°C to 200°C
Thermal Conductivity(W/m°K) 0.4
Volume Resistivity(500 V) 2 x 10^15

Applications & Features

  • Underfill
  • Fill (for Dam & Fill encapsulation)
  • Fast Flow
  • Snap Cure

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