Epoxy Underfill

Ec m22lv 1


It is necessary for flip chip applications to be able to redistribute stress away from the solder joints to extend thermal aging and cycle life. That is why Epoxyset’s flip chip underfills are formulated with a high loading of specialty fillers. This also allows for low CTEs, which help flip chip encapsulants maintain the ability to flow fast in small gaps, possessing high glass transition temperatures and high modulus.

EC-M22LV-1 is a low viscosity, low CTE underfill specially designed to fill gap sizes under 25 microns. EC-22LV-1 can also be used as the fill encapsulant in dam-and-fill applications due its low viscosity, and fast cure time. EC-M22LV-1 is used in conjunction many times with EC-M22T-1 for dam-and-fill. EC-M22LV-1 is a low ionic, low CTE, epoxy underfill that can cure within 5 minutes at 175°C. This product is used in the manufacture of rigid, flex and rigid-flex printed wiring boards (PWB’s) for high reliability applications such as space, aerospace, military, medical and high grade industrial electronics.

Product Specifications

No.of Components 1
Mix Ratio by Weight
Mixed Viscosity @RT(cps) 9,000 - 13,000
Pot Life @25°C(100 gram) 48 hrs
Recommended Cure 1hr@100°C + 2 hrs@150°C
Alternate Cure 30 min @ 165°C
Color Black
Specific Gravity 1.82
Hardness(Shore) D-92
Refractive Index
Lap Shear Strength @25°C(psi) 2000
Tg(°C) 146
CTE(Below Tg)10-6/°C 25
Service Temp.Range -55°C to 200°C
Thermal Conductivity(W/m°K) 0.4
Volume Resistivity(500 V) 2 x 10^15

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