EB-119M
EB-119M
EB-119M is a low viscosity, high temperature epoxy adhesive and potting compound. In medical devices, EB-119M is used a PZT laminating epoxy as well as backing material base epoxy. Due to its low viscosity, EB-119M is easily filled with fillers and powders for specific properties. EB-119M is a capillary flow underfill for flip chip mount die. In the electronics industry, EB-119M is excellent for coil impregnation of copper coil windings. EB-119M is used dielectric layer in the fabrication of capacitors. EB-119M is also used to bond ferrite cores and magnets. This product also changes color once cured acting as a visual indicator. It is also used in petrochemical fiber optic sensors, resisting greater than 200°C field conditions.
Product Specifications
| No.of Components | 2 |
| Mix Ratio by Weight | 100/5 |
| Mixed Viscosity @RT(cps) | 800-1200 |
| Pot Life @25°C(100 gram) | >8 hrs |
| Recommended Cure | 15-20 min @ 125°C |
| Alternate Cure | 5 min @ 150°C |
| Color | Amber |
| Specific Gravity | 1.18 |
| Hardness(Shore) | D-91 |
| Refractive Index | 1.52 |
| Lap Shear Strength @25°C(psi) | 2000 |
| Tg(°C) | 158 |
| CTE(Below Tg)10-6/°C | 38 |
| Service Temp.Range | -55°C to 230°C |
| Thermal Conductivity(W/m°K) | NA |
| Volume Resistivity(500 V) | 8 x 10^15 |
Recommended Applications
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