EB-119M is a low viscosity, high temperature epoxy adhesive and potting compound. In medical devices, EB-119M is used a PZT laminating epoxy as well as backing material base epoxy. Due to its low viscosity, EB-119M is easily filled with fillers and powders for specific properties. EB-119M is a capillary flow underfill for flip chip mount die. In the electronics industry, EB-119M is excellent for coil impregnation of copper coil windings. EB-119M is used dielectric layer in the fabrication of capacitors. EB-119M is also used to bond ferrite cores and magnets. This product also changes color once cured acting as a visual indicator. It is also used in petrochemical fiber optic sensors, resisting greater than 200°C field conditions.

Product Specifications

No.of Components 2
Mix Ratio by Weight 100/5
Mixed Viscosity @RT(cps) 800-1200
Pot Life @25°C(100 gram) >8 hrs
Recommended Cure 15-20 min @ 125°C
Alternate Cure 5 min @ 150°C
Color Amber
Specific Gravity 1.18
Hardness(Shore) D-91
Refractive Index 1.52
Lap Shear Strength @25°C(psi) 2000
Tg(°C) 158
CTE(Below Tg)10-6/°C 38
Service Temp.Range -55°C to 230°C
Thermal Conductivity(W/m°K) NA
Volume Resistivity(500 V) 8 x 10^15

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