Engineered Adhesives
Epoxyset offers a full range of epoxy, polyurethane, and silicone adhesives engineered for high performance in medical, automotive, optical, and electronic packaging applications.
High-Performance Epoxy Adhesives and Potting Compounds for Industrial and Electronic Applications
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Epoxyset is a trusted manufacturer of epoxy, urethane, and silicone compounds for electronics, medical, and industrial applications.
We supply high-performance adhesives, potting compounds, and encapsulants used in the electronics, medical device, semiconductor, fiber-optic, and automotive industries.
Potting & Encapsulating
We offer a comprehensive selection of electronic-grade epoxy, polyurethane, and silicone potting and encapsulating compounds designed to meet the most demanding specifications.
Thermal Management
We offer a full range of materials for thermal management, including thermally conductive adhesives, potting compounds, gap fillers, and thermal greases.
Custom Formulations
In addition to our extensive product line, we provide custom formulations engineered to meet specific material requirements and application needs.
Electronics
The electronics industry encompasses a wide range of demanding applications, each with its own set of adhesive performance requirements. Design engineers face increasing pressure to source reliable, cost-effective materials that meet both technical and production goals. Epoxyset provides a complete line of adhesives and potting compounds for electronic applications, including die attach, glob top encapsulation, underfill, edge bonding, ferrite and magnet bonding, and thermal interface materials. Our electronic-grade formulations simplify assembly and enhance long-term reliability across industries and emerging technologies such as 5G, IoT, and Industry 4.0. Leading component manufacturers choose Epoxyset for proven performance, engineering support, and trusted partnership.
Medical Devices
Adhesive applications in medical devices present unique challenges that require precision, reliability, and proven biocompatibility. For more than 25 years, Epoxyset has supported the medical device industry with specialized adhesives, encapsulants, and potting compounds engineered for consistent quality and performance. Many of our formulations meet biocompatibility standards such as USP Class VI and ISO 10993, ensuring safety in critical medical applications. Our products are used in a variety of devices, including acoustic imaging systems, needle-to-hub assemblies, and MRI components, where dependable bonding and long-term durability are essential.
Thermal Management
Epoxyset thermal management materials are trusted by leading manufacturers in the automotive, industrial, consumer electronics, and telecommunications industries. Our solutions are engineered to improve reliability and dissipate heat in high-power and temperature-sensitive components. The product line includes thermally conductive adhesives, potting compounds, gap fillers, greases, and putties designed to deliver consistent performance in demanding electronic assemblies.
Optical
Optical and fiber-optic applications demand adhesives with precise performance characteristics such as low viscosity, low shrinkage, high bond strength, and minimal outgassing. Epoxyset formulates a full range of optical-grade adhesives, including two-part epoxies and UV-cure epoxy and urethane acrylate systems. Typical applications include sealing components in batteries and sensitive electronics, bonding prisms, lenses, and mirrors, and assembling fiber-optic connectors for PM, polymer, and multi-mode fibers. Specialized products are also available for optical alignment and lens bonding in cameras, sensors, and touch-screen devices.
Our Recent Articles
Introduction to Thermally Conductive Epoxies In today’s high-performance world of electronics and engineering, thermally conductive epoxies are the unsung heroes keeping devices cool and reliable. These advanced adhesives are engineered to conduct heat efficiently while providing strong mechanical bonding and electrical insulation. Unlike traditional epoxies, which trap heat, thermally conductive versions transfer it away from sensitive components, reducing the risk of overheating and failure. At their core, these epoxies consist…
Active Alignment Process in Optoelectronics Active alignment is a precision assembly process used primarily in optical systems—such as camera modules, fiber-optic transceivers, LiDAR units, and photonic sensors—to ensure optimal coupling efficiency between optical components (e.g., lenses, lasers, fibers, photodiodes).Unlike passive alignment, which relies on mechanical tolerances and fiducial references, active alignment continuously monitors optical performance during assembly and adjusts the position of components in real time to achieve peak optical…
Free-Radical Curing Mechanism Used for: Acrylates, methacrylates, unsaturated polyesters, styrenics, vinyl monomers. Initiation:Free-radical initiators (e.g., peroxides, azo compounds, or UV photoinitiators) generate radicals under heat or light.Example: R−O−O−R→ 2R⋅R-O-O-R Propagation:The radical adds to a vinyl group (C=C), creating a growing chain radical. R⋅+CH2=CHX→R−CH2−CHX⋅R Termination:Two radicals combine or disproportionate, stopping growth. R⋅+R⋅→R−RR Very fast polymerization. Works with a wide variety of monomers. Common in UV-cure adhesives and 3D printing resins. Limitations:…
