Engineered Adhesives
Our line of epoxy, polyurethane, and silicone adhesives are widely used in the medical, automotive, optical, electronics, and electronics packaging.
Epoxyset is a leading manufacturer of engineered adhesives and potting compounds used in advanced technology applications.
We supply superior quality products that are used in the electronic/micro-electronics, medical device, semiconductor, fiber optics, and automotive industries.
Potting & Encapsulating
We offer a comprehensive selection of electronic grade epoxy, polyurethane, and silicone potting compounds to meet the most demanding specifications.
Thermal Management
We offer a full range of materials used for thermal management including conductive adhesives, potting compounds, gap fillers, and thermal greases.
Custom Formulations
In addition to our extensive product line, we offer custom formulations to meet your specific materials requirements and application needs.
Electronics
The electronics manufacturing industry is diverse and has continually demanding applications each with its own set of adhesive requirements. Electronics design engineers are faced with this same challenge as sourcing and costing adhesives becomes a larger part of their job. Epoxyset offers a range of adhesives for electronic applications that has been carefully selected to offer the user maximum performance in a number of ways. From component assembly, to PCB applications, to sensors, and larger power modules Epoxyset has adhesives and potting compounds for all these applications. Epoxyset’s electronic adhesives and potting compounds are offered in a variety of properties and packaging options to meet customer needs. All of our electronic grade adhesives and materials are RoHS and REACH compliant and many are halogen free.
Medical Devices
Medical device adhesive applications have a few more challenges than standard applications. Applications vary however it is crucial that component of medical devices are high in quality and consistency as well as being proven to perform. Epoxyset has been serving the medical device industry for over 20 years combining knowledge of materials and applications. Some medical device applications require adhesives formulated to pass biocompatibility testing such as USP Class VI or ISO 10993. We offer a full range of products that are USP Class VI certified or ISO 10993 approved. We offer products for use in several types of applications including acoustic imaging, bonding needles to hubs, encapsulating magnets in MRI machines and much more.
Thermal Management
Epoxyset thermal management materials are trusted by global manufacturers of electronic parts used in the automotive, industrial, consumer and telecom industries. Epoxyset thermal management solutions provide reliability-enhancing, heat-dissipating products. Our products include a variety of thermal greases, liquid gap fillers, thermal putties, and conductive adhesives and potting compounds.
Optical
Optical and fiber optic applications require very specific types of adhesives including low viscosity, low shrinkage, high bond strength, and low outgassing. Epoxyset optical adhesives include two-part epoxy adhesives and UV cure epoxy and urethane acrylates. Applications include haptic sealing in batteries and sensitive electronics, alignments in prisms, lenses, and mirrors, and fiber optic connections (PM fibers, polymer fibers, multi-mode fibers). Epoxyset offers special products for use in optical alignment applications for specialty lenses for cameras and touch screen devices.
Our Recent Articles
Utilizing potting and encapsulation compounds in your battery pack design can optimize the performance of your end product. There are three basic types of resins used in this process; these materials are epoxy, urethane, and silicone. These polymeric formulations have excellent adhesion, thermal stability and outstanding chemical resistance. Battery potting and encapsulation compounds are used to provide mechanical reinforcement to housed assemblies, to fill large voids, and to protect components…
Flip chip die attach is a technique used in the semiconductor and microelectronics industry for connecting semiconductor chips (known as dies) directly to substrates or carrier packages. In this method, the chip is flipped over and attached facedown onto the substrate or carrier using a conductive adhesive material. This is in contrast to the traditional wire bonding method, where the connections are made by bonding wires from the chip to…
Silver-filled epoxies are a type of electrically conductive adhesive that contains silver particles or flakes as a filler material within an epoxy resin matrix. These adhesives are designed to provide both electrical conductivity and strong mechanical bonding properties. They are commonly used in various applications, particularly in electronics and microelectronics, where a reliable and electrically conductive bond is required. Electrical conductivity of an adhesive is typically measured by its volume…
