Engineered Adhesives
Our line of epoxy, polyurethane, and silicone adhesives are widely used in the medical, automotive, optical, electronics, and electronics packaging.
Epoxyset is a leading manufacturer of custom formulated adhesives and potting compounds used in advanced technology applications.
We supply superior quality products that are used in the electronic/micro-electronics, medical device, semiconductor, fiber optics, and automotive industries.
Potting & Encapsulating
We offer a comprehensive selection of electronic grade epoxy, polyurethane, and silicone potting compounds to meet the most demanding specifications.
Thermal Mangement
We offer a full range of materials used for thermal management including conductive adhesives, potting compounds, gap fillers, and thermal greases.
Custom Formulations
In addition to our extensive product line, we offer custom formulations to meet your specific materials requirements and application needs.
Electronics
The electronics manufacturing industry is diverse and has continually demanding applications each with its own set of adhesive requirements. Electronics design engineers are faced with this same challenge as sourcing and costing adhesives becomes a larger part of their job. Epoxyset offers a range of adhesives for electronic applications that has been carefully selected to offer the user maximum performance in a number of ways. From component assembly, to PCB applications, to sensors, and larger power modules Epoxyset has adhesives and potting compounds for all these applications. Epoxyset’s electronic adhesives and potting compounds are offered in a variety of properties and packaging options to meet customer needs. All of our electronic grade adhesives and materials are RoHS and REACH compliant and many are halogen free.
Medical Devices
Medical device adhesive applications have a few more challenges than standard applications. Applications vary however it is crucial that component of medical devices are high in quality and consistency as well as being proven to perform. Epoxyset has been serving the medical device industry for over 20 years combining knowledge of materials and applications. Some medical device applications require adhesives formulated to pass biocompatibility testing such as USP Class VI or ISO 10993. We offer a full range of products that are USP Class VI certified or ISO 10993 approved. We offer products for use in several types of applications including acoustic imaging, bonding needles to hubs, encapsulating magnets in MRI machines and much more.
Thermal Management
Epoxyset thermal management materials are trusted by global manufacturers of electronic parts used in the automotive, industrial, consumer and telecom industries. Epoxyset thermal management solutions provide reliability-enhancing, heat-dissipating products. Our products include a variety of thermal greases, liquid gap fillers, thermal putties, and conductive adhesives and potting compounds.
Optical
Optical and fiber optic applications require very specific types of adhesives including low viscosity, low shrinkage, high bond strength, and low outgassing. Epoxyset optical adhesives include two-part epoxy adhesives and UV cure epoxy and urethane acrylates. Applications include haptic sealing in batteries and sensitive electronics, alignments in prisms, lenses, and mirrors, and fiber optic connections (PM fibers, polymer fibers, multi-mode fibers). Epoxyset offers special products for use in optical alignment applications for specialty lenses for cameras and touch screen devices.
Our Recent Articles
CLEAR LIGHT CURABLE ADHESIVE Epoxyset presents FLASHBOND UV-6502CL, a water white clear light curable adhesive for bonding, coating and sealing. Typical applications in for high strength bonding in electronics and opto-electronics industries. UV-6502CL is a very versatile adhesive with many application uses. This low viscosity, light curable adhesive is an epoxy with low cure shrinkage and high clarity. UV-6502CL cures best at 310-380nm wavelengths and will cure in under 6-8…
Epoxyset presents EPOXIBOND™ EB-116, a high strength epoxy adhesive for bonding, encapsulating and sealing. Typical applications in for high strength bonding in electronics and opto-electronics industries. EB-116 is one of the most versatile products Epoxyset offers. It is used worldwide as an adhesive, potting and encapsulating system, sealant, and coating. Applications This high strength epoxy adhesive cures to a semi-rigid polymer. Consequently it is excellent for temperature cycling from -55°C…
Delay Cure Epoxy Adhesive Epoxyset introduces a ground-breaking, light cure chemistry that allows fast processing and fixturing of parts even if both parts are opaque. This is known as a delay cure epoxy adhesive. UV-5608DC is one of a series of epoxy adhesives that can be activated by 405nm light with an intensity of about 150mW/cm2 for 5-10 seconds. Parts are mated together and aligned within 45-60 seconds of activation.…
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