Category

Electronics

ElectronicsThermal Management

Thermally Conductive Adhesives

Thermally conductive adhesives (TCAs) are specialty bonding materials that both mechanically secure components and provide a heat‐flow path between heat‐generating devices (e.g. power semiconductors, LEDs, batteries) and heat‐dissipating structures (e.g. heat sinks, chassis). They’re widely used in electronics, EV battery packs, LED modules, and aerospace systems to prevent overheating, improve reliability, and even replace mechanical fasteners. 1. Key Functions & Formats Primary roles Thermal management: fill micro-gaps and conduct heat…
Paven Patel
May 30, 2025
ElectronicsEpoxy AdhesiveUV/LED

Active Alignment Adhesives

What is active alignment? Active alignment refers to the process of fine-tuning or precisely aligning components, typically optical or mechanical systems, while the system is actively operating. This method is commonly used in the manufacturing and assembly of high-precision devices, such as cameras, sensors, and optical instruments. In contrast to "passive alignment," where components are assembled based on predetermined measurements or templates, active alignment adjusts the components in real-time while…
Paven Patel
October 2, 2024
ElectronicsEpoxy Adhesive

Electrically Conductive Epoxy

Electrically conductive epoxy is a type of adhesive that not only bonds materials together but also conducts electricity. It is commonly used in various applications where both mechanical bonding and electrical conductivity are required. Here are some key points about electrically conductive epoxy: Composition and Types 1. Conductive Fillers: These epoxies typically contain conductive fillers such as silver, copper, nickel, or carbon. Silver is the most common due to its…
Paven Patel
June 18, 2024
ElectronicsUV/LED

Advantages of UV Cure Epoxy

Cationic epoxy, more commonly UV cure epoxy, refers to a type of epoxy resin system that cures through a cationic (positively charged) polymerization mechanism. Epoxy resins are polymers widely used in various industrial applications, including adhesives, coatings, and composites, due to their excellent adhesive properties, chemical resistance, and mechanical strength. In a cationic epoxy system, the curing process involves the reaction of epoxy groups (usually present in the resin) with…
Paven Patel
March 27, 2024
Electronicspotting and encapsulating

The Importance of Choosing the Right Electronic Potting Compound

In today’s market, electronic components are subjected to some pretty brutal environments that can drastically diminish the working life of electronic devices. However, manufacturers can take steps to reduce environmental and mechanical exposures by utilizing potting compound and encapsulation methods. Advancements in materials science have led to innovative solutions to protect sensitive electronic components from damage and prolong their life. Electronic potting uses these state-of-the-art materials to create a protective…
Paven Patel
March 8, 2024
ElectronicsEpoxy Adhesive

Electrically Conductive Adhesive: Enabling Technologies in Electronics

If you’ve ever seen the inside of any modern electronic device, you’ll see the inner workings of advanced technologies held together with state-of-the-art adhesives. These adhesives are designed to help maintain the electrical current throughout the device, replacing bulky bonding methods such as solder. As such, electronic manufacturers are able to produce smaller, lighter, and more reliable devices using specially formulated electrically conductive adhesives. How Does an Electrically Conductive Adhesive…
Paven Patel
February 23, 2024
ElectronicsUV/LED

Active Alignment Adhesive: FLASHBOND UV-3720

Epoxyset, a leading manufacturer of epoxy adhesives, introduces its FLASHBOND UV-3720, a light and/or heat-curable cationic epoxy specifically designed for active alignment applications. These include camera modules, optical components, LiDAR (Light Detection and Ranging), and other ADAS (Advanced Driver Assistance Systems) assemblies used in automotive applications. During the optical assembly process of many components need to be positioned exactly and efficiently. Types of assemblies include lenses in cameras, CCD chips,…
Paven Patel
February 21, 2024
Electronics

Flip-Chip Die Attach with Conductive Epoxy for High-Performance Electronics

Flip chip die attach is a high-precision method used in the semiconductor and microelectronics industries to connect semiconductor chips (dies) directly to substrates or carrier packages. In this process, the chip is flipped face-down and bonded to the substrate using an electrically conductive adhesive, such as a silver-filled epoxy. This approach offers improved electrical performance and thermal management compared to traditional wire bonding, where thin wires connect the chip to…
Paven Patel
October 30, 2023
Electronics

Dam and Fill Encapsulation for Electronics and Semiconductor Packaging

Dam and fill encapsulation is a widely used technique in electronics manufacturing and semiconductor packaging to protect delicate components with epoxy resins or other encapsulant materials. In modern devices, components are often placed close together on circuit boards or within semiconductor packages. These components generate heat during operation, and because materials expand and contract at different rates, they can create mechanical stress that leads to solder joint failures and reduced…
Paven Patel
August 23, 2023
ElectronicsEpoxy AdhesiveUV/LED

FLASHBOND™ UV-5608DC Light Activated, Delay Cure Epoxy Adhesive

Delay Cure Epoxy Adhesive Epoxyset introduces a ground-breaking, light cure chemistry that allows fast processing and fixturing of parts even if both parts are opaque. This is known as a delay cure epoxy adhesive.  UV-5608DC is one of a series of epoxy adhesives that can be activated by 405nm light with an intensity of about 150mW/cm2 for 5-10 seconds.  Parts are mated together and aligned within 45-60 seconds of activation.…
rob_bdc
August 19, 2019