Flip chip die attach is a technique used in the semiconductor and microelectronics industry for connecting semiconductor chips (known as dies) directly to substrates or carrier packages. In this method, the chip is flipped over and attached facedown onto the substrate or carrier using a conductive adhesive material. This is in contrast to the traditional wire bonding method, where the connections are made by bonding wires from the chip to…
Paven PatelOctober 30, 2023