Category

Electronics

ElectronicsEpoxy Adhesivepotting and encapsulating

Epoxy Underfill for Electronics Assembly

Epoxy underfill is a specialized resin used to fill the gap beneath semiconductor packages to reinforce solder joints, manage thermal stress, and improve long‑term device reliability. It is used in flip-chip assemblies, ball grid arrays (BGAs), and chip-scale packages (CSPs) to improve resistance to temperature cycling, shock, vibration, and board movement.   What Epoxy Underfill Does Epoxy underfill fills the microscopic gap between a chip (flip‑chip, CSP, BGA, WLCSP) and the…
Paven Patel
October 21, 2026
ElectronicsEpoxy Adhesivepotting and encapsulating

Low Expansion Adhesives

Low expansion refers to a low coefficient of thermal expansion (CTE)—the amount a cured material expands or contracts as its temperature changes. CTE is commonly reported in parts per million per degree Celsius (ppm/°C). Specialty low-expansion epoxies can have published values around 9–18 ppm/°C, depending on the formulation and measurement conditions. Low-expansion epoxies help maintain dimensional stability in aerospace and defense assemblies exposed to temperature changes. They are particularly useful…
Paven Patel
October 6, 2026
ElectronicsEpoxy AdhesiveOptical

Epoxy Adhesives for Optical Component Manufacturing

The manufacturing of optical, fiber optic, and photonic components requires exceptional precision. From bonding optical fibers inside ferrules to securing lenses, prisms, filters, sensors, and laser components, even small changes in adhesive dimensions or mechanical properties can influence the performance of the finished optical assembly. Epoxyset develops and manufactures high-performance epoxy adhesives for optical component manufacturing, offering solutions designed to provide strong adhesion, dimensional stability, low shrinkage, environmental resistance, and…
Paven Patel
September 17, 2026
ElectronicsThermal Management

Understanding Thermal Conductivity Test Methods for Epoxy Adhesives

Understanding Thermal Conductivity Test Methods for Epoxy Adhesives As electronic devices become smaller, faster, and more powerful, managing heat has become an increasingly important design consideration. Excessive heat can reduce component performance, accelerate material degradation, and ultimately shorten the service life of electronic assemblies. For this reason, thermally conductive epoxy adhesives, potting compounds, encapsulants, and gap-filling materials are widely used to help transfer heat away from sensitive components. One of…
Paven Patel
August 27, 2026
ElectronicsEpoxy AdhesiveMedical DevicesUV/LED

The Benefits of Cationic Cure Epoxy Adhesives: High Performance for Demanding Applications

As industries continue to demand adhesives that deliver exceptional performance, reliability, and long-term durability, cationic cure epoxy adhesives have become an increasingly attractive solution. Unlike conventional epoxy systems that rely on amine hardeners, cationic cure epoxies polymerize through a photo-initiated or thermally initiated cationic reaction. This unique curing mechanism offers several advantages, including lower shrinkage, excellent adhesion, superior chemical resistance, and the ability to cure in challenging environments. From electronics…
Paven Patel
July 29, 2026
Electronicspotting and encapsulatingRecent-news

Data Center Adhesives and Encapsulants: A Guide to Materials for Reliable Electronics Protection

Data Center Adhesives and Encapsulants: Choosing the Right Materials for Reliable Electronics As artificial intelligence (AI), cloud computing, edge computing, and high-performance computing continue to expand, today's data centers are processing more information than ever before. This increased computing power places greater demands on electronic assemblies, power supplies, networking equipment, and cooling systems. While processors, GPUs, and liquid cooling technologies often receive the spotlight, data center adhesives and encapsulants are…
Paven Patel
July 16, 2026
Electronicspotting and encapsulating

Inside the Package: A Guide to Chip Encapsulation Methods

Modern electronics are marvels of miniaturization, but raw silicon dies are fragile things. Exposed to moisture, mechanical stress, or contaminants, an unprotected chip fails quickly. Encapsulation — the process of sealing a die in protective material — is what makes semiconductor devices robust enough for the real world. Here's a look at the most common encapsulation methods, what makes each one useful, and where you'll find them. Glob Top The…
Paven Patel
June 4, 2026
ElectronicsThermal Management

Thermally Conductive Adhesives

Thermally conductive adhesives (TCAs) are specialty bonding materials that both mechanically secure components and provide a heat‐flow path between heat‐generating devices (e.g. power semiconductors, LEDs, batteries) and heat‐dissipating structures (e.g. heat sinks, chassis). They’re widely used in electronics, EV battery packs, LED modules, and aerospace systems to prevent overheating, improve reliability, and even replace mechanical fasteners. 1. Key Functions & Formats Primary roles Thermal management: fill micro-gaps and conduct heat…
Paven Patel
May 30, 2025
ElectronicsEpoxy AdhesiveUV/LED

Active Alignment Adhesives

What is active alignment? Active alignment refers to the process of fine-tuning or precisely aligning components, typically optical or mechanical systems, while the system is actively operating. This method is commonly used in the manufacturing and assembly of high-precision devices, such as cameras, sensors, and optical instruments. In contrast to "passive alignment," where components are assembled based on predetermined measurements or templates, active alignment adjusts the components in real-time while…
Paven Patel
October 2, 2024
ElectronicsEpoxy Adhesive

Electrically Conductive Epoxy

Electrically conductive epoxy is a type of adhesive that not only bonds materials together but also conducts electricity. It is commonly used in various applications where both mechanical bonding and electrical conductivity are required. Here are some key points about electrically conductive epoxy: Composition and Types 1. Conductive Fillers: These epoxies typically contain conductive fillers such as silver, copper, nickel, or carbon. Silver is the most common due to its…
Paven Patel
June 18, 2024