Electronics

Flip chip die attach is a technique used in the semiconductor and microelectronics industry for connecting semiconductor chips (known as dies) directly to substrates or carrier packages. In this method, the chip is flipped over and attached facedown onto the substrate or carrier using a conductive adhesive material. This is in contrast to the traditional wire bonding method, where the connections are made by bonding wires from the chip to…

"Dam and fill" is a technique used in electronics manufacturing and semiconductor packaging to address the challenges of encapsulating delicate components with epoxy resin or other encapsulant materials. In certain electronic devices, there might be components that are placed relatively close to each other on a circuit board or within a semiconductor package. These components can generate heat during operation, and the thermal expansion and contraction rates of different materials…