High-Temperature Adhesives
Epoxyset’s high-temperature adhesives are engineered for demanding applications in the electronics, semiconductor, medical, aerospace, automotive, and other industries. These formulations cure rapidly at moderately elevated temperatures and form strong, durable bonds to metal, glass, ceramics, and several other substrates. They retain bond strength even under high-temperature conditions. Once fully cured, they provide excellent dielectric performance along with strong resistance to thermal shock and impact. They also withstand exposure to weather, water, most petroleum products, mild acids and alkalis, and a wide range of other chemicals.
