EC-350-1LV-M2 is a one component, room temperature stable glob top, underfill, or general encapsulating compound. It is one of the most versatile products for electronic assembly due to its low CTE, low viscosity, and long shelf life. EB-350-1LV-M2 also snap cures at high temperatures making it optimal for PCB applications. EB-350-1LV-M2 is a reworkable undefill. Reworkable underfills are a great option for low cost, flip chip technology. Removal of defective CSPs and BGAs is easily accomplished by heating the component and underfill to 220°C. Epoxy residues are easily scraped or brushed off.

Product Specifications

No.of Components 1
Mix Ratio by Weight NA
Mixed Viscosity @RT(cps) 15,000
Pot Life @25°C(100 gram) >3 months
Recommended Cure 2 hrs @ 125°C
Alternate Cure 1 hr @ 150°C
Color Black
Specific Gravity 1.5
Hardness(Shore) D-91
Refractive Index NA
Lap Shear Strength @25°C(psi) 2900
Tg(°C) 120
CTE(Below Tg)10-6/°C NA
Service Temp.Range -55°C to 175°C
Thermal Conductivity(W/m°K) 0.45
Volume Resistivity(500 V) >1015

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