EC-M22T-1 is a thixotropic, premixed and frozen, high temperature adhesive specially designed as an epoxy dam material for electronic assembly in dam-and-fill encapsulation. An epoxy dam makes an open barrier, or dam. Either cured or uncured, it can be filled using another epoxy or liquid adhesive. Dam-and-fill encapsulation is generally used to protect small dies or wires.

EC-M22T-1 is an engineered damming epoxy as a flow control barrier around areas of bare chip encapsulation. EC-M22T is ideal for applications requiring a taller, narrower dam. It also has very low ion content, a key feature in microelectronics. EC-M22T cures quickly with heat and is available in premixed and frozen syringes.

Product Specifications

No.of Components 1
Mix Ratio by Weight
Mixed Viscosity @RT(cps) 200,000-300,000
Pot Life @25°C(100 gram) 2 days
Recommended Cure 1hr @ 100°C + 1hr @ 150°C
Alternate Cure 2 hrs @ 150°C
Color Black
Specific Gravity 1.76
Hardness(Shore) D-92
Refractive Index
Lap Shear Strength @25°C(psi) 2000
Tg(°C) 146
CTE(Below Tg)10-6/°C 25
Service Temp.Range -55°C to 200°C
Thermal Conductivity(W/m°K) 0.3
Volume Resistivity(500 V) 2 x 10^16

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