EC-M22T-1
EC-M22T-1
EC-M22T-1 is a thixotropic, premixed and frozen, high temperature adhesive specially designed as an epoxy dam material for electronic assembly in dam-and-fill encapsulation. An epoxy dam makes an open barrier, or dam. Either cured or uncured, it can be filled using another epoxy or liquid adhesive. Dam-and-fill encapsulation is generally used to protect small dies or wires.
EC-M22T-1 is an engineered damming epoxy as a flow control barrier around areas of bare chip encapsulation. EC-M22T is ideal for applications requiring a taller, narrower dam. It also has very low ion content, a key feature in microelectronics. EC-M22T cures quickly with heat and is available in premixed and frozen syringes.
Product Specifications
| No.of Components | 1 |
| Mix Ratio by Weight | |
| Mixed Viscosity @RT(cps) | 200,000-300,000 |
| Pot Life @25°C(100 gram) | 2 days |
| Recommended Cure | 1hr @ 100°C + 1hr @ 150°C |
| Alternate Cure | 2 hrs @ 150°C |
| Color | Black |
| Specific Gravity | 1.76 |
| Hardness(Shore) | D-92 |
| Refractive Index | |
| Lap Shear Strength @25°C(psi) | 2000 |
| Tg(°C) | 146 |
| CTE(Below Tg)10-6/°C | 25 |
| Service Temp.Range | -55°C to 200°C |
| Thermal Conductivity(W/m°K) | 0.3 |
| Volume Resistivity(500 V) | 2 x 10^16 |
Recommended Applications
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