Putty & Liquid Gap Fillers
TCP putties are ultra-soft, highly conformable, one-part, non-curing paste gap fillers designed to provide efficient heat transfer between delicate components where minimal assembly pressure is required. Applied in place, these materials can accommodate a wide range of gap thicknesses while placing little or no mechanical stress on sensitive parts. They offer an effective thermal-management solution for increasingly compact devices that integrate higher-frequency electronics.
Thermal gap fillers are ultra-soft, two-part silicone polymers engineered to transfer heat efficiently while forming a secure mechanical bond. Well-suited for high-throughput production, these materials are easy to apply and can be removed cleanly after curing.
