Putty & Liquid Gap Fillers
TCP putties are ultra soft and highly conformable one part, paste type, Non-Cure type gap filler. Its consistency assures efficient heat transfer between delicate parts where minimum pressure can be tolerated. This Form-in-place gap filler is ideal for applying any thickness with little or no stress. It is designed to provide a thermal solution for the recent trends of integrating higher frequency electronics into smaller devices.
Thermal Gap Fillers are also ultra soft, 2-part silicone polymers designed to efficiently transfer heat while creating a mechanical bond. Thermal gap fillers are ideal for high throughput use and are extremely easy to clean off once cured.
