Putty & Liquid Gap Fillers

Putty & Liquid Gap Fillers

TCP putties are ultra soft and highly conformable one part, paste type, Non-Cure type gap filler. Its  consistency assures efficient heat transfer between delicate parts where minimum pressure can be tolerated. This Form-in-place gap filler is ideal for applying any thickness with little or no stress. It is designed to provide a thermal solution for the recent trends of integrating higher frequency electronics into smaller devices.

Thermal Gap Fillers are also ultra soft, 2-part silicone polymers designed to efficiently transfer heat while creating a mechanical bond. Thermal gap fillers are ideal for high throughput use and are extremely easy to clean off once cured.

Product Component Type Thermal Conductivity (W/mK) Service Temperature (°C) Viscosity (cps) Datasheet
TGF-331 2 Gap Filler 3.6 -40-205 100,000-150,000 Download
TGF-331-2 2 Gap Filler 3.6 -40-205 >500,000 Download
TCP-101 1 Putty 2.1 -40-150 >4,000,000 Download
TCP-101HT 1 Putty 3.2 -40-150 >4,500,000 Download