Thermal Gap Filler


TGF-331-2 is a high temperature resistant, liquid gap filler with very high thermal conductivity. It is a heavily filled system with heat conductive metal oxides. The material is a two-component, cured either at room or elevated temperature. The material is an excellent solution for interfacing fragile components.

Product Specifications

No.of Components 2
Mix Ratio by Weight 100:100
Mixed Viscosity @RT(cps) >500,000
Pot Life @25°C(100 gram) 20-40 minutes
Recommended Cure 30 minutes @ 100°C
Alternate Cure 16-24 hours @ 25°C
Color Blue
Specific Gravity 2.4
Hardness(Shore) A-5
Refractive Index
Lap Shear Strength @25°C(psi)
CTE(Below Tg)10-6/°C
Service Temp.Range -55°C - 200°C
Thermal Conductivity(W/m°K) 3.6
Volume Resistivity(500 V) 1 x 10^14

Recommended Applications

• Automotive electronics

• PCBA to housing

• Discrete components to housing

• Fiber optic telecommunications equipment

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