TGF-331-2
Thermal Gap Filler
TGF-331-2
TGF-331-2 is a high temperature resistant, liquid gap filler with very high thermal conductivity. It is a heavily filled system with heat conductive metal oxides. The material is a two-component, cured either at room or elevated temperature. The material is an excellent solution for interfacing fragile components.
Product Specifications
| No.of Components | 2 |
| Mix Ratio by Weight | 100:100 |
| Mixed Viscosity @RT(cps) | >500,000 |
| Pot Life @25°C(100 gram) | 20-40 minutes |
| Recommended Cure | 30 minutes @ 100°C |
| Alternate Cure | 16-24 hours @ 25°C |
| Color | Blue |
| Specific Gravity | 2.4 |
| Hardness(Shore) | A-5 |
| Refractive Index | |
| Lap Shear Strength @25°C(psi) | |
| Tg(°C) | |
| CTE(Below Tg)10-6/°C | |
| Service Temp.Range | -55°C - 200°C |
| Thermal Conductivity(W/m°K) | 3.6 |
| Volume Resistivity(500 V) | 1 x 10^14 |
Recommended Applications
• Automotive electronics
• PCBA to housing
• Discrete components to housing
• Fiber optic telecommunications equipment
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