Ec m22 scaled


EC-M22 is the prototypical epoxy underfill exhibiting low viscosity, rework ability, and low CTE. EC-M22 contains low ionic content which is very important in manufacturing PCBs. High ionic content in epoxy can lead to acidic deterioration of the PCB board and shortens the life cycle. EC-M22 cures quickly at low temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints. It is compatible with most Pb-free and Halogen-free solders. EC-M22 can also be used for edge bonding to provide added stability to larger arrays.

Product Specifications

No.of Components 1
Mix Ratio by Weight
Mixed Viscosity @RT(cps) 35,000 - 45,000
Pot Life @25°C(100 gram) 48 hrs
Recommended Cure 1hr@100°C + 2 hrs@165°C
Alternate Cure 4 hrs @ 150°C
Color Black
Specific Gravity 1.82
Hardness(Shore) D-92
Refractive Index
Lap Shear Strength @25°C(psi) 2000
Tg(°C) 146
CTE(Below Tg)10-6/°C 25
Service Temp.Range -55°C to 200°C
Thermal Conductivity(W/m°K) 0.4
Volume Resistivity(500 V) 2 x 10^15

Applications & Features

  • Edge bond underfill
  • Fill epoxy (Dam & Fill encapsulation)
  • Excellent adhesion on a wide range of materials
  • Typical applications include memory cards and
    image sensors
  • Low-temperature cure is ideal for heat sensitive

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