EC-M22
EC-M22 is the prototypical epoxy underfill exhibiting low viscosity, rework ability, and low CTE. EC-M22 contains low ionic content which is very important in manufacturing PCBs. High ionic content in epoxy can lead to acidic deterioration of the PCB board and shortens the life cycle. EC-M22 cures quickly at low temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints. It is compatible with most Pb-free and Halogen-free solders. EC-M22 can also be used for edge bonding to provide added stability to larger arrays.
Product Specifications
| No.of Components | 1 |
| Mix Ratio by Weight | |
| Mixed Viscosity @RT(cps) | 35,000 - 45,000 |
| Pot Life @25°C(100 gram) | 48 hrs |
| Recommended Cure | 1hr@100°C + 2 hrs@165°C |
| Alternate Cure | 4 hrs @ 150°C |
| Color | Black |
| Specific Gravity | 1.82 |
| Hardness(Shore) | D-92 |
| Refractive Index | |
| Lap Shear Strength @25°C(psi) | 2000 |
| Tg(°C) | 146 |
| CTE(Below Tg)10-6/°C | 25 |
| Service Temp.Range | -55°C to 200°C |
| Thermal Conductivity(W/m°K) | 0.4 |
| Volume Resistivity(500 V) | 2 x 10^15 |
Applications & Features
- Edge bond underfill
- Fill epoxy (Dam & Fill encapsulation)
- Excellent adhesion on a wide range of materials
- Typical applications include memory cards and
image sensors - Low-temperature cure is ideal for heat sensitive
components
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