EO-82M-2 is a one component system designed as a conductive thermosetting silver preparation for screen printing applications. Its composition is unique, providing high electrical and thermal conductivity with excellent bond strength after appropriate cure. EO-82M-2 epoxy is used as an advantage in place of lead-tin solders to avoid flux contamination or exposure to excessive temperature and for process simplification by screening on contacts.

By creating ohmic contacts, EO-83M-2 bonds withdoped semiconductors or if the surface of the semiconductor is metallized. The product finds extensive use in bonding semiconductor chips, integrated monolithic circuits, diodes, transistors and other components in thin film and thick film hybrid microelectronic circuits. It bonds to glass, mica, plastic, graphite, quartz and other materials as well. EO-83M-2 is stable for over 1 month without significant rise in viscosity. This can be extended if stored at temperatures below 0°C.

Product Specifications

No.of Components 1
Mix Ratio by Weight NA
Mixed Viscosity @RT(cps) 11,000 - 14,000
Pot Life @25°C(100 gram) 1 month
Recommended Cure 10-15 min @ 175°C
Alternate Cure 30-45 min @ 150°C
Color Silver
Specific Gravity 3.50
Hardness(Shore) D-88
Refractive Index NA
Lap Shear Strength @25°C(psi) >1600
Tg(°C) 126
CTE(Below Tg)10-6/°C 66
Service Temp.Range -65°C to 200°C
Thermal Conductivity(W/m°K) 2.0
Volume Resistivity(500 V)

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