Eb 119m


EB-119M is a low viscosity, unfilled epoxy adhesive and encapsulating compound. EB-119M can fill very small gap sizes through capillary flow. The capillary action of EB-119M allows fills small gaps in flip chip designs. EB-119M can cure in under 1 minute at 175°C. EB-119M can also be used a fill epoxy in dam-and-fill applications. In the optoelectronics industry, EB-119M is used in bundling optical fibers. Underfills such as EB-119M are used when the gap size for underfills is below 15-20 microns which filled systems may not be able to flow into due to the particle size.

Product Specifications

No.of Components 2
Mix Ratio by Weight 100/5
Mixed Viscosity @RT(cps) 800-1200
Pot Life @25°C(100 gram) >8 hrs
Recommended Cure 15-20 min @ 125°C
Alternate Cure 5 min @ 150°C
Color Amber
Specific Gravity 1.18
Hardness(Shore) D-91
Refractive Index 1.52
Lap Shear Strength @25°C(psi) 2000
Tg(°C) 158
CTE(Below Tg)10-6/°C 38
Service Temp.Range -55°C to 230°C
Thermal Conductivity(W/m°K) NA
Volume Resistivity(500 V) >1014

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