Category

Epoxy Adhesive

Epoxy AdhesiveMedical DevicesStructural Adhesives

Structural Epoxies

Structural epoxies are adhesives designed to transfer mechanical loads between bonded parts. They are used when a joint must withstand forces such as pulling, sliding, vibration, impact, or repeated loading throughout its service life. They can replace or supplement screws, rivets, and welds, particularly when joining different materials or when drilling holes would weaken the assembly. How structural epoxies work An epoxy resin reacts with a hardener to form a…
Paven Patel
October 29, 2026
ElectronicsEpoxy Adhesivepotting and encapsulating

Epoxy Underfill for Electronics Assembly

Epoxy underfill is a specialized resin used to fill the gap beneath semiconductor packages to reinforce solder joints, manage thermal stress, and improve long‑term device reliability. It is used in flip-chip assemblies, ball grid arrays (BGAs), and chip-scale packages (CSPs) to improve resistance to temperature cycling, shock, vibration, and board movement.   What Epoxy Underfill Does Epoxy underfill fills the microscopic gap between a chip (flip‑chip, CSP, BGA, WLCSP) and the…
Paven Patel
October 21, 2026
ElectronicsEpoxy Adhesivepotting and encapsulating

Low Expansion Adhesives

Low expansion refers to a low coefficient of thermal expansion (CTE)—the amount a cured material expands or contracts as its temperature changes. CTE is commonly reported in parts per million per degree Celsius (ppm/°C). Specialty low-expansion epoxies can have published values around 9–18 ppm/°C, depending on the formulation and measurement conditions. Low-expansion epoxies help maintain dimensional stability in aerospace and defense assemblies exposed to temperature changes. They are particularly useful…
Paven Patel
October 6, 2026
ElectronicsEpoxy AdhesiveOptical

Epoxy Adhesives for Optical Component Manufacturing

The manufacturing of optical, fiber optic, and photonic components requires exceptional precision. From bonding optical fibers inside ferrules to securing lenses, prisms, filters, sensors, and laser components, even small changes in adhesive dimensions or mechanical properties can influence the performance of the finished optical assembly. Epoxyset develops and manufactures high-performance epoxy adhesives for optical component manufacturing, offering solutions designed to provide strong adhesion, dimensional stability, low shrinkage, environmental resistance, and…
Paven Patel
September 17, 2026
Epoxy AdhesiveMedical Devices

Epoxy Adhesives Engineered to Withstand Medical Device Sterilization

Reusable Medical Devices such as endoscopes, ultrasound probes, surgical instruments, catheters, imaging equipment, and diagnostic sensors must perform reliably in environments that are demanding both mechanically and chemically. One of the most challenging requirements is repeated cleaning, disinfection, and sterilization. The adhesive holding a lens, sensor, cable, housing, transducer, or electronic assembly together may be exposed hundreds—or potentially thousands—of times to elevated temperatures, moisture, aggressive disinfectants, or sterilizing agents. Selecting…
Paven Patel
August 13, 2026
Epoxy AdhesiveMedical Devicespotting and encapsulating

New Products for Endoscope Camera Bonding

Adhesives Used in Endoscope Manufacturing: Bonding for Reliability and Performance Endoscopes are sophisticated medical devices that combine optics, electronics, illumination, and mechanical components within an extremely compact assembly. Whether used in flexible or rigid endoscopes, specialized medical-grade adhesives play an important role in maintaining structural integrity, protecting sensitive components, and supporting reliable performance. Epoxyset has developed 2 new adhesives specially formulated for use in endoscopy; specifically for lens bonding and…
Paven Patel
August 11, 2026
ElectronicsEpoxy AdhesiveMedical DevicesUV/LED

The Benefits of Cationic Cure Epoxy Adhesives: High Performance for Demanding Applications

As industries continue to demand adhesives that deliver exceptional performance, reliability, and long-term durability, cationic cure epoxy adhesives have become an increasingly attractive solution. Unlike conventional epoxy systems that rely on amine hardeners, cationic cure epoxies polymerize through a photo-initiated or thermally initiated cationic reaction. This unique curing mechanism offers several advantages, including lower shrinkage, excellent adhesion, superior chemical resistance, and the ability to cure in challenging environments. From electronics…
Paven Patel
July 29, 2026
Epoxy AdhesiveFeatured Products

Understanding Adhesive Strength: Key Mechanical Properties and What They Mean

When selecting an adhesive for an industrial, medical, or electronic assembly, understanding adhesive strength properties is critical. Different applications place different types of stress on a bonded joint, and no single strength measurement can fully characterize an adhesive’s performance. Engineers rely on several mechanical test methods to evaluate how an adhesive will perform under real-world conditions. Among the most commonly referenced adhesive properties are lap shear strength, tensile strength, die…
Paven Patel
June 18, 2026
UV/LED

Active Alignment Process in Optoelectronic Manufacturing

Active Alignment Process in Optoelectronics Active alignment is a precision assembly process used primarily in optical systems—such as camera modules, fiber-optic transceivers, LiDAR units, and photonic sensors—to ensure optimal coupling efficiency between optical components (e.g., lenses, lasers, fibers, photodiodes).Unlike passive alignment, which relies on mechanical tolerances and fiducial references, active alignment continuously monitors optical performance during assembly and adjusts the position of components in real time to achieve peak optical…
Paven Patel
October 8, 2025
UV/LED

Cationic vs Free Radical Reaction: Epoxies and Acrylate UV Cure Adhesives

Free-Radical Curing Mechanism Used for: Acrylates, methacrylates, unsaturated polyesters, styrenics, vinyl monomers. Initiation:Free-radical initiators (e.g., peroxides, azo compounds, or UV photoinitiators) generate radicals under heat or light.Example: R−O−O−R→ 2R⋅R-O-O-R  Propagation:The radical adds to a vinyl group (C=C), creating a growing chain radical. R⋅+CH2=CHX→R−CH2−CHX⋅R Termination:Two radicals combine or disproportionate, stopping growth. R⋅+R⋅→R−RR Very fast polymerization. Works with a wide variety of monomers. Common in UV-cure adhesives and 3D printing resins. Limitations:…
Paven Patel
October 3, 2025