EB-350-1LE is a specially formulated glob top epoxy with an extremely low coefficient of thermal expansion and cure shrinkage. After encapsulation, thermo-mechanical deformation builds up within the electronic packages due to the temperature coefficient of expansion mismatch between the respective materials within the package as it cools to room temperature. High shrinkage can cause mechanical stress in the encapsulated components and repeated expansion and contraction adds such stress. It is important to carefully choose the right product and apply it properly to reduce stress and minimize component damage.
EB-350-1LE has a CTE of 20ppm/°C and when cured properly has almost no shrinkage. It is room temperature stable for more than 3 months and is used as glob top encapsulant for delicate chips and wires. EB-350-1LE has a matte black finish that provides increased protection against competitors gaining component knowledge. EB-350-1LE uses soft, non-abrasive fillers and can be machine dispensed.
|Mix Ratio by Weight||NA|
|Mixed Viscosity @RT(cps)||30,000 - 40,000|
|Pot Life @25°C(100 gram)||>3 months|
|Recommended Cure||30min @ 150°C|
|Alternate Cure||2 hr @ 125°C|
|Lap Shear Strength @25°C(psi)||2400|
|Service Temp.Range||-55°C to 150°C|
|Volume Resistivity(500 V)||1 x 10^15|
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