EB-350-1LE is a specially formulated glob top epoxy with an extremely low coefficient of thermal expansion and cure shrinkage. After encapsulation, thermo-mechanical deformation builds up within the electronic packages due to the temperature coefficient of expansion mismatch between the respective materials within the package as it cools to room temperature. High shrinkage can cause mechanical stress in the encapsulated components and repeated expansion and contraction adds such stress. It is important to carefully choose the right product and apply it properly to reduce stress and minimize component damage.

EB-350-1LE has a CTE of 20ppm/°C and when cured properly has almost no shrinkage. It is room temperature stable for more than 3 months and is used as glob top encapsulant for delicate chips and wires. EB-350-1LE has a matte black finish that provides increased protection against competitors gaining component knowledge. EB-350-1LE uses soft, non-abrasive fillers and can be machine dispensed.

Product Specifications

No.of Components 1
Mix Ratio by Weight NA
Mixed Viscosity @RT(cps) 30,000 - 40,000
Pot Life @25°C(100 gram) >3 months
Recommended Cure 30min @ 150°C
Alternate Cure 2 hr @ 125°C
Color Black
Specific Gravity 1.6
Hardness(Shore) D-91
Refractive Index NA
Lap Shear Strength @25°C(psi) 2400
Tg(°C) 120
CTE(Below Tg)10-6/°C NA
Service Temp.Range -55°C to 150°C
Thermal Conductivity(W/m°K) 0.5
Volume Resistivity(500 V) 1 x 10^15

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