Solder reflow resistant epoxy


When choosing a die attach adhesive it is important to keep in mind the entire process the circuit board goes through. Many adhesives cannot withstand some of the rigorous and harsh processes especially solder reflow. Reflow soldering is the most common method of attaching surface mount components to a circuit board. The goal of the reflow process is to melt the solder and heat the adjoining surfaces, without overheating and damaging the electrical components.

EO-38M-3 is a high temperature, 2- component epoxy, electrically conductive epoxy able to withstand the rigors of reflow soldering. During this process, temperatures reach 260°C. Epoxy adhesives need to withstand degradation and keep its bond strength. EO-38M-3 is used in the photovoltaic industry to replace solder joints of copper to tin ribbon wire as well as a high performance heat sink on thermal substrates.

Product Specifications

No.of Components 2
Mix Ratio by Weight 100/100
Mixed Viscosity @RT(cps) 30,000-35,000
Pot Life @25°C(100 gram) >1 day
Recommended Cure 15 min @ 150°C
Alternate Cure 30 min @ 120°C
Color Silver
Specific Gravity 3.6
Hardness(Shore) D-88
Refractive Index NA
Lap Shear Strength @25°C(psi) 1600
Tg(°C) 95
CTE(Below Tg)10-6/°C 56
Service Temp.Range -55°C to 200°C
Thermal Conductivity(W/m°K) 2.0
Volume Resistivity(500 V) 0.0004

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