When choosing a die attach adhesive it is important to keep in mind the entire process the circuit board goes through. Many adhesives cannot withstand some of the rigorous and harsh processes especially solder reflow. Reflow soldering is the most common method of attaching surface mount components to a circuit board. The goal of the reflow process is to melt the solder and heat the adjoining surfaces, without overheating and damaging the electrical components.
EO-38M-3 is a high temperature, 2- component epoxy, electrically conductive epoxy able to withstand the rigors of reflow soldering. During this process, temperatures reach 260°C. Epoxy adhesives need to withstand degradation and keep its bond strength. EO-38M-3 is used in the photovoltaic industry to replace solder joints of copper to tin ribbon wire as well as a high performance heat sink on thermal substrates.
|Mix Ratio by Weight||100/100|
|Mixed Viscosity @RT(cps)||30,000-35,000|
|Pot Life @25°C(100 gram)||>1 day|
|Recommended Cure||15 min @ 150°C|
|Alternate Cure||30 min @ 120°C|
|Lap Shear Strength @25°C(psi)||1600|
|Service Temp.Range||-55°C to 200°C|
|Volume Resistivity(500 V)||0.0004|
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