EC-M19-1
Epoxy Underfill
EC-M19-1
EPOXICAST™ M19-1 is a highly filled, low stress liquid encapsulant with very good moisture resistance. It is exceptionally fluid and has very long working life at room temperature. M19-1 will cure very quickly at elevated temperatures. The cured system has a low coefficient of thermal expansion, high glass transition temperature, and good dielectric properties.
Product Specifications
| No.of Components | 1 |
| Mix Ratio by Weight | |
| Mixed Viscosity @RT(cps) | 20,000-25,000 |
| Pot Life @25°C(100 gram) | 48 hrs |
| Recommended Cure | 60 min @ 120°C |
| Alternate Cure | 10 min @ 160°C |
| Color | Black |
| Specific Gravity | 1.82 |
| Hardness(Shore) | D-92 |
| Refractive Index | |
| Lap Shear Strength @25°C(psi) | |
| Tg(°C) | 133 |
| CTE(Below Tg)10-6/°C | 23 |
| Service Temp.Range | 55°C-180°C |
| Thermal Conductivity(W/m°K) | NA |
| Volume Resistivity(500 V) | 2x10^16 |
Features & Applications:
- Halogen Free
- Stable electrical performance in temperature humidity bias
- High Tg
- Room Temperature Flow Capability
- Compatible with most Pb-free solders
- Long Work Life at Room Temperature
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