Epoxy Underfill


EPOXICAST™ M19-1 is a highly filled, low stress liquid encapsulant with very good moisture resistance. It is exceptionally fluid and has very long working life at room temperature. M19-1 will cure very quickly at elevated temperatures. The cured system has a low coefficient of thermal expansion, high glass transition temperature, and good dielectric properties.

Product Specifications

No.of Components 1
Mix Ratio by Weight
Mixed Viscosity @RT(cps) 20,000-25,000
Pot Life @25°C(100 gram) 48 hrs
Recommended Cure 60 min @ 120°C
Alternate Cure 10 min @ 160°C
Color Black
Specific Gravity 1.82
Hardness(Shore) D-92
Refractive Index
Lap Shear Strength @25°C(psi)
Tg(°C) 133
CTE(Below Tg)10-6/°C 23
Service Temp.Range 55°C-180°C
Thermal Conductivity(W/m°K) NA
Volume Resistivity(500 V) 2x10^16

Features & Applications:

  • Halogen Free
  • Stable electrical performance in temperature humidity bias
  • High Tg
  • Room Temperature Flow Capability
  • Compatible with most Pb-free solders
  • Long Work Life at Room Temperature

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