Epoxy Underfill

Ec m19lv scaled


EPOXICAST™ M19-LV is a highly filled, low stress liquid encapsulant with very good moisture resistance. It is exceptionally fluid and has very long working life at room temperature. M19-LV can be used as a fill epoxy in dam-and-fill applications. The cured system has a low coefficient of thermal expansion, high glass transition temperature, and good dielectric properties.

EPOXICAST™ M19-LV can be used for bare chip protection in a variety of advanced packages such as IC memory cards, chip carriers, hybrid circuits, chip-on-board, multi-chip modules, and pin grid & ball grid arrays.

Product Specifications

No.of Components 1
Mix Ratio by Weight
Mixed Viscosity @RT(cps) 9,000-12,000
Pot Life @25°C(100 gram) 48 hrs
Recommended Cure 1 hr/100°C + 2 hr/125°C
Alternate Cure 30 min/150°C
Color Black
Specific Gravity 1.82
Hardness(Shore) D-92
Refractive Index
Lap Shear Strength @25°C(psi)
Tg(°C) 145
CTE(Below Tg)10-6/°C 26
Service Temp.Range 55°C-180°C
Thermal Conductivity(W/m°K) NA
Volume Resistivity(500 V) 2x10^16

Applications & Features

  • Underfill
  • Fill (for Dam & Fill encapsulation)
  • Fast Flow
  • Snap Cure

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