EPOXICAST™ M19-LV is a highly filled, low stress liquid encapsulant with very good moisture resistance. It is exceptionally fluid and has very long working life at room temperature. M19-LV can be used as a fill epoxy in dam-and-fill applications. The cured system has a low coefficient of thermal expansion, high glass transition temperature, and good dielectric properties.
EPOXICAST™ M19-LV can be used for bare chip protection in a variety of advanced packages such as IC memory cards, chip carriers, hybrid circuits, chip-on-board, multi-chip modules, and pin grid & ball grid arrays.
|Mix Ratio by Weight|
|Mixed Viscosity @RT(cps)||9,000-12,000|
|Pot Life @25°C(100 gram)||48 hrs|
|Recommended Cure||1 hr/100°C + 2 hr/125°C|
|Alternate Cure||30 min/150°C|
|Lap Shear Strength @25°C(psi)|
|Volume Resistivity(500 V)||2x10^16|
Features & Applications:
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