EC-M21
LOW VISCOSITY UNDERFILL ENCAPSULANT
EC-M21
EPOXICAST™ M21 is a low viscosity, high temperature underfill epoxy encapsulant. Usable as a stand alone underfill or as an encapsulating material in dam-and-fill applications, EC-M21 exhibits high strength, high Tg, and long work life for versatile use. This highly filled epoxy, a low CTE helps keep fragile components from movement during temperature cycling.
Product Specifications
| No.of Components | 1 |
| Mix Ratio by Weight | |
| Mixed Viscosity @RT(cps) | 4,000-6,000 |
| Pot Life @25°C(100 gram) | 48 hrs |
| Recommended Cure | 60 min @ 125°C |
| Alternate Cure | 15 min @ 150°C |
| Color | Black |
| Specific Gravity | 1.62 |
| Hardness(Shore) | D-90 |
| Refractive Index | |
| Lap Shear Strength @25°C(psi) | 1500 |
| Tg(°C) | 124 |
| CTE(Below Tg)10-6/°C | 37 |
| Service Temp.Range | -55°C-220°C |
| Thermal Conductivity(W/m°K) | NA |
| Volume Resistivity(500 V) | 1.0x10^16 |
Features & Applications:
- One Component
- High Tg
- Fast cure at moderate temperatures
- Room Temperature Flow Capability
- Compatible with most Pb-free solders
- Long Work Life at Room Temperature
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