EPOXICAST™ M3121-RW is a reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.

Product Specifications

No.of Components 1
Mix Ratio by Weight
Mixed Viscosity @RT(cps) 900-1300
Pot Life @25°C(100 gram) 7 days
Recommended Cure 10 min @ 130°C
Alternate Cure 3-5 min @ 175°C
Color Amber
Specific Gravity 1.13
Hardness(Shore) D-72
Refractive Index
Lap Shear Strength @25°C(psi) 1500
Tg(°C) 80
CTE(Below Tg)10-6/°C 56
Service Temp.Range -55°C-250°C
Thermal Conductivity(W/m°K) NA
Volume Resistivity(500 V) 2 x 10^16

Features & Applications:

  • One Component
  • Stable electrical performance in temperature humidity bias
  • Fast cure at moderate temperatures
  • Room Temperature Flow Capability
  • Compatible with most Pb-free solders
  • Long Work Life at Room Temperature

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