Used as an alternative to AI Technology ME8452-A, EO-98HT is used highly in snapcuring applications. This highly silver-filled epoxy paste adhesive is solvent free, re-workable, and electrically and thermally conductive. With outstanding strengthfor bonding materials with highly mismatched CTE’s (i.e. alumina to aluminum, silicon to copper). EO-98HT can be easily reworked at elevated temperatures(80 to 100 °C) and is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials with highly mismatched CTE’s. Both viscosity and thixotropic index makes it screen printable, automated, or dispensed manually. EO-98HT is available in various size syringes for automatic needle dispensing applications or in bulk sized jars.

Product Specifications

No.of Components 1
Mix Ratio by Weight NA
Mixed Viscosity @RT(cps) 35,000-55,000
Pot Life @25°C(100 gram) 1 month
Recommended Cure 5 min @ 150°C
Alternate Cure 30 min @ 125°C
Color Silver
Specific Gravity 3.50
Hardness(Shore) D-85
Refractive Index NA
Lap Shear Strength @25°C(psi) >1200
Tg(°C) 136
CTE(Below Tg)10-6/°C 42
Service Temp.Range -55°C to 250°C
Thermal Conductivity(W/m°K) 1.8
Volume Resistivity(500 V) 0.0003

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