EO-21

Die attach epoxy adhesive

EO-21

Die attachment is the step in integrated circuit packaging during which a die is mounted and fixed onto the chip carrier (package or another die). Electrically conductive epoxy adhesives are generally used in this process due to its strong bond strength of components onto printed circuitry. Applications used for epoxy die attach include simple transistors, encapsulation of wire bonds, LED attachment, MCMs and hybrids.

EO-21 is a two-component, silver filled, electrically conductive epoxy. Used extensively for die attach applications, EO-21 has excellent bond strength of the die to various substrates. A highly filled epoxy, EO-21 offers outstanding volume resistivity of

Product Specifications

No.of Components 2
Mix Ratio by Weight 100/4
Mixed Viscosity @RT(cps) 30,000-40,000
Pot Life @25°C(100 gram) 1 hr
Recommended Cure 1 hr @ 100°C
Alternate Cure 24-48 hrs @ 25°C
Color Silver
Specific Gravity 3.00
Hardness(Shore) D-84
Refractive Index NA
Lap Shear Strength @25°C(psi) 1700
Tg(°C) 68
CTE(Below Tg)10-6/°C 42
Service Temp.Range -55°C to 150°C
Thermal Conductivity(W/m°K) 2.2
Volume Resistivity(500 V) 0.0004

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