EO-21
Die attach epoxy adhesive
EO-21
Die attachment is the step in integrated circuit packaging during which a die is mounted and fixed onto the chip carrier (package or another die). Electrically conductive epoxy adhesives are generally used in this process due to its strong bond strength of components onto printed circuitry. Applications used for epoxy die attach include simple transistors, encapsulation of wire bonds, LED attachment, MCMs and hybrids.
EO-21 is a two-component, silver filled, electrically conductive epoxy. Used extensively for die attach applications, EO-21 has excellent bond strength of the die to various substrates. A highly filled epoxy, EO-21 offers outstanding volume resistivity of
Product Specifications
| No.of Components | 2 |
| Mix Ratio by Weight | 100/4 |
| Mixed Viscosity @RT(cps) | 30,000-40,000 |
| Pot Life @25°C(100 gram) | 1 hr |
| Recommended Cure | 1 hr @ 100°C |
| Alternate Cure | 24-48 hrs @ 25°C |
| Color | Silver |
| Specific Gravity | 3.00 |
| Hardness(Shore) | D-84 |
| Refractive Index | NA |
| Lap Shear Strength @25°C(psi) | 1700 |
| Tg(°C) | 68 |
| CTE(Below Tg)10-6/°C | 42 |
| Service Temp.Range | -55°C to 150°C |
| Thermal Conductivity(W/m°K) | 2.2 |
| Volume Resistivity(500 V) | 0.0004 |
Recommended Applications
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