EB-411HP
EB-411HP
EPOXIBOND™ EB-411HP is one component, aluminum filled, heat-curing epoxy adhesive which offers excellent thermal stability and high bond strength to metals, glass and many other substrates in the 120°C to 180°C temperature range. This low temperature (125°C) curing adhesive has very good water, solvent and chemical resistance.
EB-411HP is formulated to meet the requirements of Federal Specification MMM A-132 for Type II heat resistant structural adhesive. It also passes NASA outgassing requirements.
EB-411HP is a high performance equivalent product to 3M Scotch-Weld™ 2214 Gray and LOCTITE® E-214HP.
Product Specifications
No.of Components | 1 |
Mix Ratio by Weight | |
Mixed Viscosity @RT(cps) | >500,000 |
Pot Life @25°C(100 gram) | |
Recommended Cure | 45 min @125°C |
Alternate Cure | 10 min @ 150°C |
Color | Gray |
Specific Gravity | 1.4 |
Hardness(Shore) | D-84 |
Refractive Index | NA |
Lap Shear Strength @25°C(psi) | 4500 |
Tg(°C) | 125 |
CTE(Below Tg)10-6/°C | 47 |
Service Temp.Range | -55°C to 230°C |
Thermal Conductivity(W/m°K) | 1.5 |
Volume Resistivity(500 V) | 3x10^13 |
Recommended Applications
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