EPOXIBOND™ EB-411HP is one component, aluminum filled, heat-curing epoxy adhesive which offers excellent thermal stability and high bond strength to metals, glass and many other substrates in the 120°C to 180°C temperature range. This low temperature (125°C) curing adhesive has very good water, solvent and chemical resistance.

EB-411HP is formulated to meet the requirements of Federal Specification MMM A-132 for Type II heat resistant structural adhesive. It also passes NASA outgassing requirements.

EB-411HP is a high performance equivalent product to 3M Scotch-Weld™ 2214 Gray and LOCTITE® E-214HP.

Product Specifications

No.of Components 1
Mix Ratio by Weight
Mixed Viscosity @RT(cps) >500,000
Pot Life @25°C(100 gram)
Recommended Cure 45 min @125°C
Alternate Cure 10 min @ 150°C
Color Gray
Specific Gravity 1.4
Hardness(Shore) D-84
Refractive Index NA
Lap Shear Strength @25°C(psi) 4500
Tg(°C) 125
CTE(Below Tg)10-6/°C 47
Service Temp.Range -55°C to 230°C
Thermal Conductivity(W/m°K) 1.5
Volume Resistivity(500 V) 3x10^13

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