EPOXIBOND™ EB-411HP is one component, aluminum filled, heat-curing epoxy adhesive which offers excellent thermal stability and high
bond strength to metals, glass and many other substrates in the 120°C to 180°C temperature range. This low temperature
(125°C) curing adhesive has very good water, solvent and chemical resistance.
EB-411HP is formulated to meet the requirements of Federal Specification MMM A-132 for Type II heat resistant structural
EB-411HP is a high performance equivalent product to 3M Scotch-Weld™ 2214 Gray and LOCTITE® E-214HP.
|Mix Ratio by Weight|
|Mixed Viscosity @RT(cps)||>500,000|
|Pot Life @25°C(100 gram)|
|Recommended Cure||45 min @125°C|
|Alternate Cure||10 min @ 150°C|
|Lap Shear Strength @25°C(psi)||4500|
|Service Temp.Range||-55°C to 230°C|
|Volume Resistivity(500 V)||3x10^13|
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