Reworkable epoxy underfill


EPOXICAST™ M3119-RW is a reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.

Product Specifications

No.of Components 1
Mix Ratio by Weight NA
Mixed Viscosity @RT(cps) 1000-15000
Pot Life @25°C(100 gram) 7 days
Recommended Cure 10 min @ 130°C
Alternate Cure 3-5 min @ 175°C
Color Amber
Specific Gravity 1.15
Hardness(Shore) D-83
Refractive Index NA
Lap Shear Strength @25°C(psi) 1500
Tg(°C) 106
CTE(Below Tg)10-6/°C 55
Service Temp.Range -55°C-250°C
Thermal Conductivity(W/m°K) NA
Volume Resistivity(500 V) 1 x 10^16

Features & Applications:

  • One Component
  • Reworkable epoxy underfill
  • Fast cure at high temperatures
  • Room Temperature Flow Capability
  • Compatible with most Pb-free solders
  • Long Work Life at Room Temperature

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