EB-485
Thermally Conductive Epoxy
EB-485
EPOXIBOND EB-485 adhesive is designed for assembly applications that require thermal management. It is also recommended for low stress bonding applications. EB-485 can be used with a variety of hardeners depending on the desired properties. EB-485 has a very high thermal conductivity, bond strength, and work life depending on the hardener choice.
Product Specifications
| No.of Components | 2 |
| Mix Ratio by Weight | 100/3.5 |
| Mixed Viscosity @RT(cps) | 60,000-80,000 |
| Pot Life @25°C(100 gram) | 30-45 min |
| Recommended Cure | 2hrs @ 70°C |
| Alternate Cure | 24 hrs @ 25°C |
| Color | Black |
| Specific Gravity | 2.3 |
| Hardness(Shore) | D-90 |
| Refractive Index | |
| Lap Shear Strength @25°C(psi) | 2400 |
| Tg(°C) | 90 |
| CTE(Below Tg)10-6/°C | 26 |
| Service Temp.Range | -55°C to 130°C |
| Thermal Conductivity(W/m°K) | 1.44 |
| Volume Resistivity(500 V) | >10^14 |
Recommended Applications
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