A sometimes overlooked property of adhesive materials is the thermal resistance. What is thermal resistance?Thermal resistance is the temperature difference across a structure when a unit of heat energy flows through it in unit time.The thermal resistance of materials is of great interest to electronic engineers because most electrical components generate heat and need to be cooled. Electronic components malfunction or fail if they overheat, and some parts routinely need measures taken in the design stage to prevent this.
EB-485 is 2-part, thermally conductive epoxy adhesive that can be combined multiple hardeners to offer different properties. The most standard hardener is EH-9 which offers a good general purpose epoxy adhesive with good chemical resistance and physical strength. With EH-21LP, the system becomes low viscosity, long pot life, and has good thermal shock and impact resistance. Also with EH-21LP, it has excellent low temperature properties and adhesion to glass. For high temperature properties and excellent chemical resistance, we recommend EH-6.
|Mix Ratio by Weight||100/3.5|
|Mixed Viscosity @RT(cps)||60,000-80,000|
|Pot Life @25°C(100 gram)||30-45 min|
|Recommended Cure||2hrs @ 70°C|
|Alternate Cure||24 hrs @ 25°C|
|Lap Shear Strength @25°C(psi)||2400|
|Service Temp.Range||-55°C to 130°C|
|Volume Resistivity(500 V)||>10^14|
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