Category

Thermal Management

Thermal Management

TGF-331 -Thermally Conductive Liquid Gap Filler

Epoxyset's dispensable liquid gap fillers round out its line of thermal management compounds designed for ease of use and high performance. Highlight by easy 1:1 mix ratios and excellent rheological properties, our thermally conductive liquid gap filler products are ideal for use in high volume applications such as filling air gaps in automatic electronic control units (ECU). Other applications include¬†LED bonding, PCBA to housing, discrete component to heat spreader, computer…
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June 14, 2019