EB-102/EH-12

How can you bond dissimilar substrates?

EB-102/EH-12

Bonding dissimilar substrates such as plastic to metal or rubber to glass is a common problem in almost every industry including medical, aerospace, electronics, and automotive. The issue is differences in the coefficient of thermal expansion(CTE) for each substrate. When materials expand and contract at different rates and the adhesive cannot compensate, this can lead to bond failure and part failure in the field. EB-102 is designed as a high bond strength, 2-part, epoxy adhesive especially useful for bonding dissimilar substrates. A room temperature cure adhesive, EB-102 has very high bond strength with internal flexibility preventing de-bonding of materials with different CTE values.

Product Specifications

No.of Components 2
Mix Ratio by Weight 100/100
Mixed Viscosity @RT(cps) 25,000-35,000
Pot Life @25°C(100 gram) 2 hrs
Recommended Cure 2 hrs @ 65°C
Alternate Cure 24-48 hrs @ 25°C
Color Clear Amber
Specific Gravity 1.10
Hardness(Shore) D-82
Refractive Index
Lap Shear Strength @25°C(psi) 3500
Tg(°C) 70
CTE(Below Tg)10-6/°C 68
Service Temp.Range -55°C to 150°C
Thermal Conductivity(W/m°K) NA
Volume Resistivity(500 V) >10^15

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