EB-403-1 is a one component, highly filled, thermally conductive adhesive. EB-403-1 employs conductive fillers using different particle sizes which increases conductivity and decreases settlement. Studies show that significant decreases in the viscosities can be obtained using a two-component filler system which permits the use of higher filler loadings. The increase in the ratio of coarse filler to fine filler reduced the flexural strength of the castings and increased the rate of settling in the formulations.

EB-403-1 is used as an adhesive in several electronics products including hybrid multi-chip modules, high temperature oscillators, and crystal and IC filters. It is used inhigh temperature crystal oscillator product platforms for extreme environment applications. Typical operating temperature range is from –55°C to +200°C but can go as high as 230°C.

Product Specifications

No.of Components 1
Mix Ratio by Weight NA
Mixed Viscosity @RT(cps) >800,000
Pot Life @25°C(100 gram) 4 months
Recommended Cure 1hr@100°C+1hr@150°C
Alternate Cure 30min @ 150°C
Color Black
Specific Gravity 2.1
Hardness(Shore) D-90
Refractive Index NA
Lap Shear Strength @25°C(psi) 2620
Tg(°C) 145
CTE(Below Tg)10-6/°C 28
Service Temp.Range -55°C to 220°C
Thermal Conductivity(W/m°K) 1.8
Volume Resistivity(500 V) 6.0 x 10^15

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