EC-1006

EPOXY POTTING COMPOUND

EC-1006

EPOXICAST-1006/EH-24 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. The cured system provides excellent resistance to moisture, most organic solvents and inorganic chemicals. Typical Applications includes potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc.

Product Specifications

No.of Components 2
Mix Ratio by Weight 100/16
Mixed Viscosity @RT(cps) 1400-1800
Pot Life @25°C(100 gram) 2-3 hours
Recommended Cure 2hrs @ 25°C + 1 hr @ 100°C
Alternate Cure 24 hours @ 25°C
Color Black
Specific Gravity 1.58
Hardness(Shore) D-89
Refractive Index NA
Lap Shear Strength @25°C(psi) NA
Tg(°C) 78
CTE(Below Tg)10-6/°C 39
Service Temp.Range -55°C to 120°C
Thermal Conductivity(W/m°K) 0.35
Volume Resistivity(500 V) 3.0 x 10^15

Recommended Applications

Potting and encapsulating power supplies, transformers, electric motors, capacitors, batteries, coils, insulators, sensors, devices for intrinsic safety

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