EC-1006 Epoxy Potting Compound for Thermal and Electrical Protection

Why Choose EC-1006 for Potting and Encapsulation

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EC-1006

EPOXICAST-1006/EH-24 is a low-viscosity, filled epoxy resin system that is easily pourable for convenient processing. It offers high thermal conductivity, excellent electrical insulation, and low shrinkage during cure.

This epoxy potting compound is ideal for potting and encapsulating components and modules where efficient heat dissipation and resistance to mechanical and thermal shock are critical. Once cured, the system provides reliable protection with strong resistance to moisture, organic solvents, and inorganic chemicals.

Typical applications include densely packaged power supplies, integrated circuits, small transformers, capacitors, and bushings.

Product Specifications

No.of Components 2
Mix Ratio by Weight 100/16
Mixed Viscosity @RT(cps) 1400-1800
Pot Life @25°C(100 gram) 2-3 hours
Recommended Cure 2hrs @ 25°C + 1 hr @ 100°C
Alternate Cure 24 hours @ 25°C
Color Black
Specific Gravity 1.58
Hardness(Shore) D-89
Refractive Index NA
Lap Shear Strength @25°C(psi) NA
Tg(°C) 78
CTE(Below Tg)10-6/°C 39
Service Temp.Range -55°C to 120°C
Thermal Conductivity(W/m°K) 0.35
Volume Resistivity(500 V) 3.0 x 10^15

Recommended Applications

  • Potting and encapsulating power supplies for reliable thermal management

  • Small and large transformers requiring electrical insulation and heat dissipation

  • Electric motors exposed to vibration and thermal cycling

  • Capacitors in high-density or high-voltage assemblies

  • Battery packs requiring protection from moisture and shock

  • Inductive coils and windings in electronic circuits

  • Insulators exposed to moisture, chemicals, or temperature extremes

  • Sensors and instrumentation for industrial and electronic applications

  • Devices requiring intrinsic safety, including hazardous environment electronics

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