EC-1006M-4 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. Typical Applications includes potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc.
UL File No: E198161 under “Plastic – Components” for 94V0 Flame Retardant
|Mix Ratio by Weight||100:12|
|Mixed Viscosity @RT(cps)||4000|
|Pot Life @25°C(100 gram)||5-6 hours|
|Recommended Cure||1-2 hours @ 100°C|
|Alternate Cure||24 hours @ 25°C|
|Lap Shear Strength @25°C(psi)||NA|
|Service Temp.Range||-55°C - 120°C|
|Volume Resistivity(500 V)||1 x 10^14|
Potting capacitors, transistors, and other power supply and transmission components.
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