EC-1006M-4

FLEXIBLE THERMALLY CONDUCTIVE POTTING COMPOUND

EC-1006M-4

EC-1006M-4 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. Typical Applications includes potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc.

UL File No: E198161 under “Plastic – Components” for 94V0 Flame Retardant

Product Specifications

No.of Components 2
Mix Ratio by Weight 100:12
Mixed Viscosity @RT(cps) 4000
Pot Life @25°C(100 gram) 5-6 hours
Recommended Cure 1-2 hours @ 100°C
Alternate Cure 24 hours @ 25°C
Color Black
Specific Gravity 1.62
Hardness(Shore) A-85
Refractive Index NA
Lap Shear Strength @25°C(psi) NA
Tg(°C) 28
CTE(Below Tg)10-6/°C NA
Service Temp.Range -55°C - 120°C
Thermal Conductivity(W/m°K) 0.8
Volume Resistivity(500 V) 1 x 10^14

Recommended Applications

Potting capacitors, transistors, and other power supply and transmission components.

Coil Impregnation

Motor/Stator Potting

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