EC-1015 is a low viscosity, thermal potting compound exhibiting excellent electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.
|Mix Ratio by Weight||100:25|
|Mixed Viscosity @RT(cps)||3,000-5,000|
|Pot Life @25°C(100 gram)||8 hours|
|Recommended Cure||2 hrs @ 70°C + 2 hrs @ 150°C|
|Alternate Cure||4 hours @ 100°C|
|Lap Shear Strength @25°C(psi)||NA|
|Service Temp.Range||-55°C - 180°C|
|Volume Resistivity(500 V)||1 x 10^16|
- Excellent performance in densely packaged power supplies
- Integrated circuits
- Thick film hybrid devices
- D/A converters
- Transformers and semiconductors etc.
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