EC-1015
THERMALLY CONDUCTIVE POTTING COMPOUND
EC-1015
EC-1015 is a low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.
Product Specifications
| No.of Components | 2 |
| Mix Ratio by Weight | 100:25 |
| Mixed Viscosity @RT(cps) | 3,000-5,000 |
| Pot Life @25°C(100 gram) | 8 hours |
| Recommended Cure | 2 hrs @ 70°C + 2 hrs @ 150°C |
| Alternate Cure | 4 hours @ 100°C |
| Color | Black |
| Specific Gravity | 1.95 |
| Hardness(Shore) | D-92 |
| Refractive Index | NA |
| Lap Shear Strength @25°C(psi) | NA |
| Tg(°C) | 145 |
| CTE(Below Tg)10-6/°C | 34 |
| Service Temp.Range | -55°C - 180°C |
| Thermal Conductivity(W/m°K) | 1.2 |
| Volume Resistivity(500 V) | 1 x 10^16 |
Recommended Applications
Excellent performance in densely packaged power supplies, integrated circuits, thick film hybrid devices, D/A converters, oscillators, amplifiers, relays, transformers and semiconductors etc.
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