EC-1015

THERMALLY CONDUCTIVE POTTING COMPOUND

EC-1015

EC-1015 is a low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.

Product Specifications

No.of Components 2
Mix Ratio by Weight 100:25
Mixed Viscosity @RT(cps) 3,000-5,000
Pot Life @25°C(100 gram) 8 hours
Recommended Cure 2 hrs @ 70°C + 2 hrs @ 150°C
Alternate Cure 4 hours @ 100°C
Color Black
Specific Gravity 1.95
Hardness(Shore) D-92
Refractive Index NA
Lap Shear Strength @25°C(psi) NA
Tg(°C) 145
CTE(Below Tg)10-6/°C 34
Service Temp.Range -55°C - 180°C
Thermal Conductivity(W/m°K) 1.2
Volume Resistivity(500 V) 1 x 10^16

Recommended Applications

Excellent performance in densely packaged power supplies, integrated circuits, thick film hybrid devices, D/A converters, oscillators, amplifiers, relays, transformers and semiconductors etc.

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