Thermal Potting Compound


EC-1850FT-LV is a pourable filled epoxy resin system offering excellent heat transfer, high voltage insulation, low exotherm and minimum shrinkage. It is a lower viscosity version of EC-1850FT. It rapidly transfers heat, eliminates hot spot, and increases the operating efficiency of most encapsulated devices. Its low shrinkage minimizes risk of damage to fragile components. It is useful for potting and encapsulating densely packaged power supplies and heat generating components, integrated circuits, power and operational amplifiers, transformers and many types of semiconductors.

Product Specifications

No.of Components 2
Mix Ratio by Weight 100:3.5 (with EH-9)
Mixed Viscosity @RT(cps) 4000-8000 (with EH-9)
Pot Life @25°C(100 gram) 40-60 min
Recommended Cure 2 hours @ 70°C
Alternate Cure 24 hours @ 25°C
Color Black
Specific Gravity 2.3
Hardness(Shore) D-94
Refractive Index NA
Lap Shear Strength @25°C(psi) 2400
Tg(°C) 86
CTE(Below Tg)10-6/°C 26
Service Temp.Range -55°C - 130°C
Thermal Conductivity(W/m°K) 1.53
Volume Resistivity(500 V) 2 x 10^15

Recommended Applications

  • Equipment modules
  • Power supplies
  • Relays and amplifiers
  • Transformers
  • Coils and ferrite cores
  • Coil Winding Impregnation
  • Encapsulation of circuit boards

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